PESD1LIN NXP Semiconductors, PESD1LIN Datasheet - Page 3

• Manufacturer Part Number: PESD1LIN
• Description: PESD1LIN in a very small SOD323 (SC-76) Surface-Mounted Device (SMD) plasticpackage designed to protect one automotive Local Interconnect Network (LIN) bus linefrom the damage caused by ElectroStatic Discharge (ESD) and other transients
• Manufacturer: NXP Semiconductors

NXP Semiconductors
PESD1LIN
Product data sheet
Fig 1.
(%)
I
PP
120
80
40
0
0
IEC 61000-4-5
8/20 s pulse waveform according to
10
100 % I
Table 6.
[1]
Table 7.
Symbol
V
Standard
IEC 61000-4-2; level 4 (ESD)
MIL-STD-883; class 3 (human body model)
e
ESD
−t
PP
Device stressed with ten non-repetitive ESD pulses.
20
; 8 μs
50 % I
ESD maximum ratings
ESD standards compliance
Parameter
electrostatic discharge
voltage
30
PP
; 20 μs
All information provided in this document is subject to legal disclaimers.
001aaa630
t (μs)
40
Rev. 3 — 31 May 2011
Fig 2.
Conditions
IEC 61000-4-2
(contact discharge)
MIL-STD-883
(human body model)
100 %
10 %
90 %
ESD pulse waveform according to
IEC 61000-4-2
I
PP
Conditions
> 15 kV (air); > 8 kV (contact)
> 4 kV
t
r
30 ns
= 0.7 ns to 1 ns
LIN-bus ESD protection diode
60 ns
[1]
Min
-
-
PESD1LIN
© NXP B.V. 2011. All rights reserved.
Max
23
10
001aaa631
Unit
kV
kV
t
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