SAM9M10 Atmel Corporation, SAM9M10 Datasheet - Page 231
SAM9M10
Manufacturer Part Number
SAM9M10
Description
Manufacturer
Atmel Corporation
Datasheets
1.M40800.pdf
(284 pages)
2.SAM9261.pdf
(248 pages)
3.SAM9M10.pdf
(59 pages)
4.SAM9M10.pdf
(1398 pages)
Specifications of SAM9M10
Flash (kbytes)
0 Kbytes
Pin Count
324
Max. Operating Frequency
400 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
160
Ext Interrupts
160
Usb Transceiver
3
Usb Speed
Hi-Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
2
Uart
5
Lin
4
Ssc
2
Ethernet
1
Sd / Emmc
2
Graphic Lcd
Yes
Video Decoder
Yes
Camera Interface
Yes
Adc Channels
8
Adc Resolution (bits)
10
Adc Speed (ksps)
440
Resistive Touch Screen
Yes
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
64
Self Program Memory
NO
External Bus Interface
2
Dram Memory
DDR2/LPDDR, SDRAM/LPSDR
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
0.9 to 1.1
Fpu
No
Mpu / Mmu
No / Yes
Timers
6
Output Compare Channels
6
Input Capture Channels
6
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
No
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ARM DDI 0029G
When the BYPASS instruction is loaded into the instruction register, all the scan cells
assume their normal system mode of operation. The BYPASS instruction has no effect
on the system pins:
•
•
•
All unused instruction codes default to the BYPASS instruction.
BYPASS does not enable the processor to exit debug state or synchronize to MCLK for
a system speed access while in debug state. You must use RESTART to achieve this.
In the CAPTURE-DR state, a logic 0 is captured the bypass register.
In the SHIFT-DR state, test data is shifted into the bypass register through TDI
and shifted out through TDO after a delay of one TCK cycle. The first bit to shift
out is a zero.
In the UPDATE-DR state, the bypass register is not affected.
Note
Copyright © 1994-2001. All rights reserved.
Debug in Depth
B-13
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