SAM9M10 Atmel Corporation, SAM9M10 Datasheet - Page 198

no-image

SAM9M10

Manufacturer Part Number
SAM9M10
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM9M10

Flash (kbytes)
0 Kbytes
Pin Count
324
Max. Operating Frequency
400 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
160
Ext Interrupts
160
Usb Transceiver
3
Usb Speed
Hi-Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
2
Uart
5
Lin
4
Ssc
2
Ethernet
1
Sd / Emmc
2
Graphic Lcd
Yes
Video Decoder
Yes
Camera Interface
Yes
Adc Channels
8
Adc Resolution (bits)
10
Adc Speed (ksps)
440
Resistive Touch Screen
Yes
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
64
Self Program Memory
NO
External Bus Interface
2
Dram Memory
DDR2/LPDDR, SDRAM/LPSDR
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
0.9 to 1.1
Fpu
No
Mpu / Mmu
No / Yes
Timers
6
Output Compare Channels
6
Input Capture Channels
6
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
No
AC and DC Parameters
7.22
7-26
Address latch enable control
Figure 7-22 shows the ARM7TDMI reset period timing. The timing parameters used in
Figure 7-22 are listed in Table 7-21.
In Figure 7-22, T
address in phase 2. If ALE is driven LOW after T
is known as address breakthrough.
Note
Copyright © 1994-2001. All rights reserved.
MAS[1:0]
nTRANS
ald
A[31:0]
MCLK
LOCK
nOPC
is the time by which ALE must be driven LOW to latch the current
nRW
ALE
Symbol
T
T
T
ald
ale
aleh
Table 7-21 ALE address control timing parameters
Parameter
Address group latch output time
Address group latch open output delay
Address group latch output hold time
Phase 1
T
ale
ald
, then a new address is latched. This
T
aleh
Figure 7-22 ALE control timing
T
ald
Phase 2
ARM DDI 0029G
Maximum
Maximum
Minimum
Parameter
type

Related parts for SAM9M10