NCP2890AFCT2G ON Semiconductor, NCP2890AFCT2G Datasheet - Page 10

• Manufacturer Part Number: NCP2890AFCT2G
• Description: IC AMP AUDIO POWER 1W 9-FLIPCHIP
• Manufacturer: ON Semiconductor
• Type: Class ABr

Specifications of NCP2890AFCT2G

• Output Type: 1-Channel (Mono)
• Max Output Power X Channels @ Load: 1.08W x 1 @ 8 Ohm
• Voltage - Supply: 2.2 V ~ 5.5 V
• Features: Depop, Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
• Mounting Type: Surface Mount
• Package / Case: 9-FlipChip
• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 1-Channel Mono
• Output Power (typ): 1.08x1@8OhmW
• Audio Amplifier Function: Speaker
• Total Harmonic Distortion: 0.04%%
• Single Supply Voltage (typ): 3/5V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Power Dissipation: 650mW
• Rail/rail I/o Type: No
• Power Supply Rejection Ratio: 75dB
• Single Supply Voltage (min): 2.2V
• Single Supply Voltage (max): 5.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 9
• Package Type: Flip-Chip
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NCP2890AFCT2G; NCP2890AFCT2GOSTR

700
600
500
400
300
200
100
0.25
0.15
0.05
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.2
0.1
0
0
0
Figure 35. Power Derating − 9−Pin Flip−Chip CSP
0
0
0
200 mm
Figure 31. Power Dissipation versus Output
P
for V
R
Figure 33. Power Dissipation versus Output
Dmax
L
= 8 W
20
p
0.2
= 5 V,
= 633 mW
2
T
50 mm
A
40
, AMBIENT TEMPERATURE (°C)
0.1
P
P
out
out
0.4
2
, OUTPUT POWER (W)
, OUTPUT POWER (W)
60
V
R
F = 1 kHz
THD + N < 0.1%
p
L
= 5 V
= 8 W
Power
V
R
F = 1 kHz
THD + N < 0.1%
Power
p
L
0.6
80
= 3 V
0.2
= 8 W
TYPICAL PERFORMANCE CHARACTERISTICS
PCB Heatsink Area
100
500 mm
0.8
120
2
0.3
NCP2890, NCV2890
1
140
http://onsemi.com
160
1.2
0.4
10
0.25
0.15
0.05
0.35
0.25
0.15
0.05
180
160
140
120
100
0.3
0.2
0.1
0.4
0.3
0.2
0.1
80
60
40
0
0
0
0
50
Figure 36. Maximum Die Temperature versus
Figure 32. Power Dissipation versus Output
Figure 34. Power Dissipation versus Output
V
p
= 2.6 V
0.05
V
p
0.1
100
V
= 3.3 V
p
0.1
= 4.2 V
R
PCB HEATSINK AREA (mm
P
P
V
L
out
out
p
PCB Heatsink Area
= 4 W
R
V
F = 1 kHz
THD + N < 0.1%
= 5 V
L
p
, OUTPUT POWER (W)
, OUTPUT POWER (W)
0.15
= 8 W
= 2.6 V
V
R
F = 1 kHz
THD + N < 0.1%
Maximum Die Temperature 150°C
150
0.2
p
L
= 3.3 V
= 8 W
Power
Power
0.2
R
200
0.3
0.25
L
= 8 W
2
0.3
)
250
0.4
0.35
300
0.4
0.5