ncp2890-d ON Semiconductor, ncp2890-d Datasheet
ncp2890-d
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ncp2890-d Summary of contents
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... The NCP2890 is an audio power amplifier designed for portable communication device applications such as mobile phone applications. The NCP2890 is capable of delivering 1 continuous average power to an 8.0 W BTL load from a 5.0 V power supply, and 320 4.0 W BTL load from a 2.6 V power supply. ...
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... Ri − 390 BYPASS bypass SHUTDOWN VIH VIL Figure 2. Typical Audio Amplifier Application Circuit with a Differential Input This device contains 671 active transistors and 1899 MOS gates. NCP2890, NCV2890 − OUTA + ...
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... Negative input of the first amplifier, receives the audio input signal. Connected to the feedback resistor R and to the input resistor R f OUTA Negative output of the NCP2890. Connected to the load and to the feedback resistor Rf. INP Positive input of the first amplifier, receives the common mode voltage. VM_P Power Analog Ground ...
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... This parameter is not tested in production for 9−Pin Flip−Chip CSP package in case of a 5.0 V power supply. 8. See page 11 for a theoretical approach of this parameter. 9. For this parameter, the Min/Max values are given for information. NCP2890, NCV2890 between −40°C to +85°C (Unless otherwise noted). A ...
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... FREQUENCY (Hz) Figure 3. THD + N versus Frequency 2 100 mW out 0.1 0.01 0.001 10 100 1000 FREQUENCY (Hz) Figure 5. THD + N versus Frequency NCP2890, NCV2890 1 0.1 0.01 0.001 10,000 100,000 10 Figure 2. THD + N versus Frequency 1 0.1 0.01 0.001 10,000 100,000 10 Figure 4. THD + N versus Frequency ...
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... Figure 9. THD + N versus Power Out 1700 kHz 1500 = 1300 THD+N = 10% 1100 900 700 500 300 100 2.0 2.5 3.0 3.5 POWER SUPPLY (V) Figure 11. Output Power versus Power Supply NCP2890, NCV2890 10 1 0.1 0.01 0.001 400 500 600 0 Figure 8. THD + N versus Power Out kHz 1 A 0.1 0.01 300 400 0 Figure 10 ...
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... 200 mV ripple pk−pk − bypass −60 −70 −80 −90 −100 10 100 1000 FREQUENCY (Hz) Figure 17 SRR NCP2890, NCV2890 −25 −30 −35 −40 −45 −50 −55 −60 −65 10,000 100,000 −30 −35 −40 −45 −50 −55 −60 − ...
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... 200 mV ripple pk−pk − bypass −60 −70 −80 −90 −100 10 100 1000 FREQUENCY (Hz) Figure 23 SRR p NCP2890, NCV2890 −30 −35 −40 −45 −50 −55 −60 −65 −70 −75 10 10,000 100,000 = −30 −35 −40 −45 −50 −55 −60 − ...
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... DC OUTPUT VOLTAGE (V) Figure 27 Output Voltage SRR Figure 29. Turning On Time − V NCP2890, NCV2890 0 −10 −20 −30 −40 −50 −60 −70 −80 10,000 100,000 −5 −4 − Figure 26. P ...
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... P = 633 mW Dmax 100 for 100 T , AMBIENT TEMPERATURE (°C) A Figure 35. Power Derating − 9−Pin Flip−Chip CSP NCP2890, NCV2890 0.3 0.25 0.2 0.15 0.1 0. 1.2 0 0.1 Figure 32. Power Dissipation versus Output 0.4 0.35 R 0.3 0.25 0.2 0.15 0.1 0.05 0 0.3 0.4 0 0.05 0.1 Figure 34. Power Dissipation versus Output ...
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... Detailed Description The NCP2890 audio amplifier can operate under 2.6 V until 5.5 V power supply. It delivers 320 mW rms output power to 4.0 W load (V = 2.6 V) and 1.0 W rms output p power to 8.0 W load (V = 5.0 V). p The structure of the NCP2890 is basically composed of two identical internal power amplifiers; the first one is externally configurable with gain− ...
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... In order to optimize device and system performance, the NCP2890 should be used in low gain configurations. The low gain configuration minimizes THD + noise values and maximizes the signal to noise ratio, and the amplifier can still be used without running into the bandwidth limitations ...
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... NCP2890, NCV2890 Silkscreen Layer Top Layer Figure 38. Demonstration Board for 9−Pin Flip−Chip CSP Device − PCB Layers http://onsemi.com Bottom Layer 13 ...
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... NOTE: This product is offered with either eutectic (SnPb−tin/lead) or lead−free solder bumps (G suffix) depending on the PCB assembly process. The NCP2890AFCT2G version requires a lead−free solder paste and should not be used with a SnPb solder paste. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D ...
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... NCP2890, NCV2890 PACKAGE DIMENSIONS −A− 0.10 C −B− E TOP VIEW A 0.10 C 0.05 C −C− A2 SEATING A1 PLANE SIDE VIEW 0. 0.03 C BOTTOM VIEW SOLDERING FOOTPRINT* 0.265 0.01 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D ...
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... Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com NCP2890, NCV2890 PACKAGE DIMENSIONS Micro8t CASE 846A−02 ISSUE G NOTES: 1 ...