TDA7293V STMicroelectronics, TDA7293V Datasheet - Page 12

• Manufacturer Part Number: TDA7293V
• Description: IC AMP AUDIO 100W AB MULTIWATT15
• Manufacturer: STMicroelectronics
• Type: Class ABr

Specifications of TDA7293V

• Output Type: 1-Channel (Mono)
• Max Output Power X Channels @ Load: 100W x 1 @ 4 Ohm
• Voltage - Supply: ±12 V ~ 50 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Package / Case: Multiwatt-15 (Vertical, Bent and Staggered Leads)
• Product: Class-AB
• Output Power: 100 W
• Available Set Gain: 80 dB
• Thd Plus Noise: 0.005 %
• Operating Supply Voltage: +/- 60 V
• Supply Current: 10 A
• Maximum Power Dissipation: 50000 mW
• Maximum Operating Temperature: + 70 C
• Mounting Style: Through Hole
• Audio Load Resistance: 8 Ohms
• Dual Supply Voltage: +/- 15 V, +/- 18 V, +/- 24 V, +/- 28 V
• Input Bias Current (max): 1 uA
• Input Offset Voltage: 10 mV
• Input Signal Type: Single
• Minimum Operating Temperature: 0 C
• Output Signal Type: Single
• Supply Type: Dual
• Amplifier Class: AB
• No. Of Channels: 1
• Supply Voltage Range: ± 12V To ± 50V
• Load Impedance: 4ohm
• Operating Temperature Range: 0°C To +70°C
• Amplifier Case Style: Multiwatt15
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-2170-5

Applications information
4.4
4.5
12/21
Modular application (ref. figure 12)
The modular application is where several devices operate in parallel.
The modular application allows very high power be delivered to very low-impedance loads.
In this type of application one device acts as a master and the others as slaves.
The slave power stages are driven by the master device and work in parallel together while
the input and the gain stages of the slave devices are disabled. The figure below shows the
connections required to configure two devices to work together.
Bootstrap capacitor
For compatibility purpose with the previous devices of the family, the bootstrap capacitor can
be connected either between the bootstrap pin (6) and the output pin (14) or between the
bootstrap pin (6) and the bootstrap loader pin (12).
When the bootstrap is connected between pins 6 and 14 the maximum supply voltage in the
presence of an output signal is limited to 100 V, due the bootstrap capacitor overvoltage.
When the bootstrap is connected between pins 6 and 12 the maximum supply voltage
extends to the full voltage that the technology can stand, in this case 120 V.
This is accomplished by the clamp introduced at the bootstrap loader pin (12). This pin
follows the output voltage up to 100 V and remains clamped at 100 V for higher output
voltages.
This feature lets the output voltage swing up to a gate-source voltage from the positive
supply (V
The master chip connections are the same as the normal single ones.
The outputs can be connected together without the need of any ballast resistor.
The slave SGND pin must be tied to the negative supply.
The slave STANDBY and MUTE pins must be connected to the master STANDBY and
MUTE pins.
The bootstrap lines must be connected together and the bootstrap capacitor must be
increased: for N devices the bootstrap capacitor must be 22 µF times N.
The slave IN pin must be connected to the negative supply.
S
-3 to 6 V).
Doc ID 6744 Rev 8
TDA7293