SC16C754IB80,557 NXP Semiconductors, SC16C754IB80,557 Datasheet - Page 47

• Manufacturer Part Number: SC16C754IB80,557
• Description: IC UART QUAD W/FIFO 80-LQFP
• Manufacturer: NXP Semiconductors

Specifications of SC16C754IB80,557

• Number Of Channels: 4, QUART
• Fifo's: 64 Byte
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 80-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935270057557; SC16C754IB80; SC16C754IB80

Philips Semiconductors
14. Revision history
Table 28:
9397 750 11618
Product data
Rev Date
04
03
02
01
20030619
20030415
20030314
20030124
Revision history
CPCN
-
-
-
-
Description
Product data (9397 750 11618); ECN 853-2411 30036 of 16 June 2003.
Modifications:
Product data (9397 750 11374); ECN 853-2411 29796 of 11 April 2003.
Product data (9397 750 11192); ECN 853-2411 29625 of 07 March 2003.
Product data (9397 750 10891); ECN 853-2411 29395 of 16 January 2003.
•
•
•
[3]
[4]
[5]
[6]
[7]
Figure 13 “Crystal oscillator connection.” on page
connection with resistor.
Table 25 “DC electrical characteristics” on page
Table 26 “AC electrical
strobe width’, and re-number subsequent note.
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Rev. 04 — 19 June 2003
characteristics”: add
Table note
35: I
20: changed capacitors’ values and added
10 C measured in the atmosphere of the reflow
CCsleep
2, its reference to parameter ‘IOW
Quad UART with 64-byte FIFO
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
: change all values to 1 mA nom.
SC16C754
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