SC16IS740IPW,112 NXP Semiconductors, SC16IS740IPW,112 Datasheet - Page 58
![IC UART SINGLE W/FIFO 16-TSSOP](/photos/6/56/65607/568-16-tssop_sot403-1_sml.jpg)
SC16IS740IPW,112
Manufacturer Part Number
SC16IS740IPW,112
Description
IC UART SINGLE W/FIFO 16-TSSOP
Manufacturer
NXP Semiconductors
Type
UART with 64-byte FIFOs and IrDA encoder/decoderr
Datasheet
1.SC16IS740IPW112.pdf
(62 pages)
Specifications of SC16IS740IPW,112
Number Of Channels
1, UART
Package / Case
16-TSSOP (0.173", 4.40mm Width)
Fifo's
64 Byte
Protocol
RS232, RS485
Voltage - Supply
2.5V, 3.3V, 5V
With Auto Flow Control
Yes
With False Start Bit Detection
Yes
With Modem Control
Yes
Mounting Type
Surface Mount
Data Rate
5 Mbps
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.3 V
Supply Current
6 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Operating Supply Voltage
2.5 V, 3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-4000 - DEMO BOARD SPI/I2C TO DUAL UART568-3510 - DEMO BOARD SPI/I2C TO UART
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-3648-5
935280988112
SC16IS740IPW
935280988112
SC16IS740IPW
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SC16IS740IPW,112
Manufacturer:
JAMICON
Quantity:
101
NXP Semiconductors
SC16IS740_750_760_6
Product data sheet
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 41.
Table 42.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
•
•
2.5
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 41
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
42
Single UART with I
44.
Rev. 06 — 13 May 2008
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
2
C-bus/SPI interface, 64-byte FIFOs, IrDA SIR
Figure
350 to 2000
260
250
245
SC16IS740/750/760
44) than a SnPb process, thus
220
220
350
> 2000
260
245
245
© NXP B.V. 2008. All rights reserved.
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