LPC1810FET100,551 NXP Semiconductors, LPC1810FET100,551 Datasheet - Page 81
LPC1810FET100,551
Manufacturer Part Number
LPC1810FET100,551
Description
IC MCU 32BIT 136KB FLSH 100TFBGA
Manufacturer
NXP Semiconductors
Series
LPC18xxr
Datasheets
1.LPC1830FET256551.pdf
(87 pages)
2.LPC1810FET100551.pdf
(2 pages)
3.LPC1810FET100551.pdf
(1164 pages)
Specifications of LPC1810FET100,551
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
64
Program Memory Size
-
Program Memory Type
ROMless
Eeprom Size
-
Ram Size
136K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TFBGA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
NXP Semiconductors
14. Package outline
Fig 27. Package outline LBGA256 package sot740_2
LPC1850_30_20_10
Objective data sheet
LBGA256: plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT740-2
VERSION
OUTLINE
max
1.55
A
ball A1
index area
ball A1
index area
0.45
0.35
A
1
M
K
H
D
B
T
P
F
G
R
N
C
A
L
E
J
1.1
0.9
A
2
1
IEC
- - -
2
0.55
0.45
b
3
e
4
17.2
16.8
5
D
6
7
17.2
16.8
8
MO-192
JEDEC
E
e
D
All information provided in this document is subject to legal disclaimers.
1
9
10
1/2 e
REFERENCES
11
e
1
Rev. 1.2 — 17 February 2011
12
13
0
15
e
14
1
b
15
JEITA
16
15
e
- - -
2
scale
5
1/2 e
0.25
B
v
∅
∅
e
w
v
A
E
e
M
M
2
0.1
w
C
C
10 mm
A B
0.12
y
32-bit ARM Cortex-M3 microcontroller
A
0.35
y
LPC1850/30/20/10
A
1
y
2
1
C
A
1
PROJECTION
EUROPEAN
detail X
X
C
y
© NXP B.V. 2011. All rights reserved.
ISSUE DATE
05-06-16
05-08-04
SOT740-2
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