TDA5230XT Infineon Technologies, TDA5230XT Datasheet - Page 163

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TDA5230XT

Manufacturer Part Number
TDA5230XT
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of TDA5230XT

Operating Temperature (min)
-40C
Operating Temperature (max)
105C
Operating Temperature Classification
Industrial
Product Depth (mm)
4.4mm
Product Length (mm)
9.7mm
Lead Free Status / Rohs Status
Compliant
Dual:
ADDR:
Dual:
ADDR:
Dual:
ADDR:
Dual:
ADDR:
Data Sheet
4:0
7:3
2:0
7:0
7:0
Bit R/W Description
Bit R/W Description
Bit R/W Description
Bit R/W Description
ATSILENB
W
ATSIGAP
W
W
ATSIPTA0
W
ATSIPTA1
W
0x84
0x85
0x86
0x87
TSI B Length (in chips):
(0x11 up to 0x1F not used)
Min: 00h =0 bit (see also ATSILENA)
Max: 10h = 16 chips = 8 bits
TSIGAP: TSI Gap (T/2 bit resolution)
1Fh: 15 1/2 bits gap
00h: 0 bit gap
TSIGAP is used to lock the PLL after TSI A is found, if the TSI detection
mode 10b is selected.
GAPVAL: TSI Gap (T/16 bit resolution)
111b: 7/16 bit gap
000b: 0 bit gap
GAPVAL is used to correct the DCO phase after TSIGAP time, if the
TSIMODE.TSIGRSYN is disabled
TSIPTA0: Data Pattern for TSI comparison : Bit 7...Bit 0(LSB) (in chips)
TSIPTA1: Data Pattern for TSI Comparison: Bit 15(MSB)...Bit 8 (in chips)
and
and
and
and
and BTSIGAP:
0xA4
0xA5
0xA6
0xA7
and BTSIPTA0:
and BTSIPTA1:
and BTSILENB:
TSI GAP
TSI Data Reference Low Byte A
TSI Data Reference High Byte A
TSI B Length
159
Register Descriptions
Reset Value: 0x00
Reset Value: 0x00
Reset Value: 0x00
Reset Value: 0x00
Version 4.0, 2007-06-01
TDA523x

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