AM29LV033C-90EI Spansion Inc., AM29LV033C-90EI Datasheet - Page 8

• Manufacturer Part Number: AM29LV033C-90EI
• Manufacturer: Spansion Inc.

Specifications of AM29LV033C-90EI

• Cell Type: NOR
• Density: 32Mb
• Access Time (max): 90ns
• Interface Type: Parallel
• Boot Type: Not Required
• Address Bus: 22b
• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8b
• Number Of Words: 4M
• Supply Current: 16mA
• Mounting: Surface Mount
• Pin Count: 40
• Lead Free Status / Rohs Status: Not Compliant

CONNECTION DIAGRAMS
Special Handling Instructions for FBGA
Packages
Special handling is required for Flash Memor y
products in FBGA packages.
6
NC*
NC*
NC*
NC*
A8
A7
A1
A2
NC*
NC*
NC*
B8
B7
B1
RY/BY#
WE#
A14
C7
C6
C4
C2
A9
C5
C3
A7
A3
* Balls are shorted together via the substrate but not connected to the die.
RESET#
ACC
A13
A18
D7
D6
D4
D2
A8
D5
D3
A4
63-Ball FBGA (Top View, Balls Down)
D A T A
A15
A11
E7
E6
NC
E4
NC
E2
E5
E3
A6
A2
Am29LV033C
A16
A12
F7
F6
NC
F4
NC
F2
A5
A1
F5
F3
S H E E T
DQ5
DQ2
DQ0
A17
A19
G7
G6
G4
G2
G5
G3
A0
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150°C for prolonged periods of time.
DQ3
CE#
A10
H7
NC
H6
NC
H4
NC
H2
H5
H3
DQ6
OE#
V
V
A20
NC
J7
J6
J4
J2
J5
J3
CC
CC
DQ7
DQ4
DQ1
V
A21
V
K7
K6
K4
K2
K5
K3
22268B5 September 12, 2006
SS
SS
NC*
NC*
NC*
NC*
L8
L7
L1
L2
NC*
NC*
NC*
NC*
M8
M7
M1
M2