CY7C1370C-167AC Cypress Semiconductor Corp, CY7C1370C-167AC Datasheet - Page 6
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CY7C1370C-167AC
Manufacturer Part Number
CY7C1370C-167AC
Description
Manufacturer
Cypress Semiconductor Corp
Datasheet
1.CY7C1370C-167AC.pdf
(27 pages)
Specifications of CY7C1370C-167AC
Density
18Mb
Access Time (max)
3.4ns
Sync/async
Synchronous
Architecture
SDR
Clock Freq (max)
166MHz
Operating Supply Voltage (typ)
3.3V
Address Bus
19b
Package Type
TQFP
Operating Temp Range
0C to 70C
Number Of Ports
1
Supply Current
275mA
Operating Supply Voltage (min)
3.135V
Operating Supply Voltage (max)
3.465V
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
100
Word Size
36b
Number Of Words
512K
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CY7C1370C-167AC
Manufacturer:
CYPRESS
Quantity:
230
Part Number:
CY7C1370C-167AC
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Document #: 38-05233 Rev. *D
Pin Definitions
A0
A1
A
BW
BW
BW
BW
WE
ADV/LD
CLK
CE
CE
CE
OE
CEN
DQ
DQ
DQ
DQ
DQP
DQP
DQP
DQP
MODE
TDO
TDI
TMS
TCK
V
V
Pin Name
DD
DDQ
1
2
3
a
b
c
d
a
b
c
d
a
b
c
d
JTAG serial output
I/O Power Supply Power supply for the I/O circuitry.
JTAG serial input
Test Mode Select
Input Strap Pin
Asynchronous
Power Supply
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
JTAG-Clock
I/O Type
Input-
Input-
Input-
Input-
Input-
Input-
Input-
Input-
Input-
Input-
Clock
I/O-
I/O-
Address Inputs used to select one of the address locations. Sampled at the rising edge of
the CLK.
Byte Write Select Inputs, active LOW. Qualified with WE to conduct writes to the SRAM.
Sampled on the rising edge of CLK. BW
BW
Write Enable Input, active LOW. Sampled on the rising edge of CLK if CEN is active LOW. This
signal must be asserted LOW to initiate a write sequence.
Advance/Load Input used to advance the on-chip address counter or load a new address.
When HIGH (and CEN is asserted LOW) the internal burst counter is advanced. When LOW, a
new address can be loaded into the device for an access. After being deselected, ADV/LD should
be driven LOW in order to load a new address.
Clock Input. Used to capture all synchronous inputs to the device. CLK is qualified with CEN.
CLK is only recognized if CEN is active LOW.
Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with
CE
Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction with
CE
Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with
CE
Output Enable, active LOW. Combined with the synchronous logic block inside the device to
control the direction of the I/O pins. When LOW, the I/O pins are allowed to behave as outputs.
When deasserted HIGH, I/O pins are three-stated, and act as input data pins. OE is masked
during the data portion of a write sequence, during the first clock when emerging from a
deselected state and when the device has been deselected.
Clock Enable Input, active LOW. When asserted LOW the clock signal is recognized by the
SRAM. When deasserted HIGH the clock signal is masked. Since deasserting CEN does not
deselect the device, CEN can be used to extend the previous cycle when required.
Bidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is triggered
by the rising edge of CLK. As outputs, they deliver the data contained in the memory location
specified by A
controlled by OE and the internal control logic. When OE is asserted LOW, the pins can behave
as outputs. When HIGH, DQ
automatically three-stated during the data portion of a write sequence, during the first clock when
emerging from a deselected state, and when the device is deselected, regardless of the state of
OE.
Bidirectional Data Parity I/O lines. Functionally, these signals are identical to DQ
write sequences, DQP
BW
Mode Input. Selects the burst order of the device. Tied HIGH selects the interleaved burst order.
Pulled LOW selects the linear burst order. MODE should not change states during operation.
When left floating MODE will default HIGH, to an interleaved burst order.
Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK.
Serial data-In to the JTAG circuit. Sampled on the rising edge of TCK.
This pin controls the Test Access Port state machine. Sampled on the rising edge of TCK.
Clock input to the JTAG circuitry.
Power supply inputs to the core of the device.
2
1
1
c
c
and CE
, and DQP
and CE
and CE
controls DQ
2
3
3
to select/deselect the device.
to select/deselect the device.
to select/deselect the device.
[17:0]
d
is controlled by BW
c
and DQP
during the previous clock rise of the read cycle. The direction of the pins is
a
is controlled by BW
c
a
, BW
–DQ
d
d
controls DQ
are placed in a three-state condition. The outputs are
d
.
Pin Description
a
controls DQ
a
, DQP
d
and DQP
b
is controlled by BW
a
and DQP
d
.
a
, BW
b
controls DQ
b
, DQP
CY7C1370C
CY7C1372C
c
is controlled by
[31:0]
b
Page 6 of 27
and DQP
. During
b
,
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