PCF8562TT NXP Semiconductors, PCF8562TT Datasheet - Page 32

PCF8562TT

Manufacturer Part Number
PCF8562TT
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PCF8562TT

Operating Supply Voltage (typ)
2.5/3.3/5V
Number Of Digits
16
Number Of Segments
128
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Package Type
TSSOP
Pin Count
48
Mounting
Surface Mount
Power Dissipation
400mW
Frequency (max)
400KHz
Operating Supply Voltage (min)
1.8V
Operating Supply Voltage (max)
5.5V
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PCF8562TT
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
PCF8562TT/2
Manufacturer:
NXP Semiconductors
Quantity:
36 137
Part Number:
PCF8562TT/2
Manufacturer:
NXP
Quantity:
12 000
Part Number:
PCF8562TT/2
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
PCF8562TT/2
0
Part Number:
PCF8562TT/2Ј¬118
Manufacturer:
NXP
Quantity:
64 000
NXP Semiconductors
PCF8562_2
Product data sheet
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 20.
Table 21.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
2.5
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 20
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
21
22.
Rev. 02 — 22 January 2007
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Universal LCD driver for low multiplex rates
Figure
350 to 2000
260
250
245
22) than a PbSn process, thus
220
220
350
> 2000
260
245
245
PCF8562
© NXP B.V. 2007. All rights reserved.
32 of 36

Related parts for PCF8562TT