PCF8574P NXP Semiconductors, PCF8574P Datasheet - Page 19

PCF8574P

Manufacturer Part Number
PCF8574P
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PCF8574P

Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Operating Temperature (max)
85C
Package Type
PDIP
Rad Hardened
No
Lead Free Status / Rohs Status
Compliant

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Philips Semiconductors
2002 Nov 22
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
Remote 8-bit I/O expander for I
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT266-1
max.
1.5
A
0.15
A
0
1
20
1
Z
y
A
1.4
1.2
2
pin 1 index
IEC
0.25
A
3
e
D
0.32
0.20
b
p
MO-152
0.20
0.13
JEDEC
c
b
p
REFERENCES
D
6.6
6.4
0
(1)
11
10
2
C-bus
w
E
4.5
4.3
M
(1)
scale
EIAJ
0.65
19
2.5
e
c
H
6.6
6.2
E
A
2
5 mm
A
1.0
L
1
0.75
0.45
L
p
H
E
E
detail X
0.65
0.45
Q
L
L
PROJECTION
p
EUROPEAN
Q
0.2
v
(A )
3
A
0.13
w
Product specification
A
X
v
0.1
y
M
PCF8574
ISSUE DATE
A
95-02-22
99-12-27
0.48
0.18
Z
(1)
SOT266-1
10
0
o
o

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