INA-31063 Avago Technologies US Inc., INA-31063 Datasheet - Page 8

• Manufacturer Part Number: INA-31063
• Manufacturer: Avago Technologies US Inc.

Specifications of INA-31063

• Manufacturer's Type: RFIC Amplifier
• Number Of Channels: 1
• Supply Current: 13.5@3VmA
• Frequency (max): 2.5GHz
• Operating Supply Voltage (typ): 3V
• Operating Supply Voltage (max): 6V
• Package Type: SOT-363
• Mounting: Surface Mount
• Pin Count: 6
• Noise Figure (typ): 6.1@1900MHzdB
• Lead Free Status / Rohs Status: Not Compliant

SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT-363
package, will reach solder reflow
temperatures faster than those
with a greater mass.
The INA-31063 has been qualified
to the time-temperature profile
shown in Figure 22. This profile is
representative of an IR reflow
type of surface mount assembly
process. After ramping up from
room temperature, the circuit
board with components attached
Figure 22. Surface Mount Assembly Profile.
250
200
150
100
50
0
0
60
Preheat
Zone
120
TIME (seconds)
to it (held in place with solder
paste) passes through one or
more preheat zones. The preheat
zones increase the temperature of
the board and components to
prevent thermal shock and begin
evaporating solvents from the
solder paste. The reflow zone
briefly elevates the temperature
sufficiently to produce a reflow of
the solder.
The rates of change of tempera-
ture for the ramp-up and cool
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock.
These parameters are typical for
a surface mount assembly
process for the INA-31063. As a
general guideline, the circuit
board and components should
only be exposed to the minimum
temperatures and times necessary
Reflow
Zone
180
Cool Down
Zone
240
T
MAX
300
to achieve a uniform reflow of
solder.
For more information on mount-
ing considerations for packaged
microwave semiconductors,
please refer to Agilent application
note AN-A006.
Electrostatic Sensitivity
INA-31063 is robust in design,
permanent damage may occur to
these devices if they are sub-
jected to high-energy electrostatic
discharges. Electrostatic charges
as high as several thousand volts
(which readily accumulate on the
human body and on test equip-
ment) can discharge without
degradation in performance,
reliability, or failure. Electronic
devices may be subjected to ESD
damage in any of the following
areas:
• Storage & handling
• Inspection & testing
• Assembly
• In-circuit use
The INA-31063 is an ESD Class 1
device. Therefore, proper ESD
precautions are recommended
when handling, inspecting,
testing, assembling, and using
these devices to avoid damage.
For more information on Electro-
static Discharge and Control refer
to Agilent application note AN-
A004R.
8
RFICs are electrostatic
discharge (ESD)
sensitive devices.
Although the