EA-XPR-007 Embedded Artists, EA-XPR-007 Datasheet - Page 59

no-image

EA-XPR-007

Manufacturer Part Number
EA-XPR-007
Description
BOARD LPCXPRESSO LPC11U14
Manufacturer
Embedded Artists
Datasheets

Specifications of EA-XPR-007

Lead Free Status / Rohs Status
Lead free / RoHS Compliant
NXP Semiconductors
Fig 34. Package outline TFBGA48 (SOT1155-2)
LPC11U1X
Objective data sheet
TFBGA48: plastic thin fine-pitch ball grid array package; 48 balls; body 4.5 x 4.5 x 0.7 mm
Dimensions
mm
SOT1155-2
Unit
Outline
version
nom
max
min
1.10
0.95
0.85
ball A1
index area
ball A1
index area
A
0.30
0.25
0.20
A
1
H
G
D
C
F
E
B
A
0.80
0.70
0.65
A
IEC
2
1
0.35
0.30
0.25
e
b
2
4.6
4.5
4.4
3
D
4
4.6
4.5
4.4
e
D
JEDEC
E
1
All information provided in this document is subject to legal disclaimers.
- - -
5
0
1/2 e
0.5
e
6
References
b
7
3.5
e
Rev. 1 — 11 April 2011
1
8
3.5
e
2
JEITA
1/2 e
0.15
scale
B
e
v
Ø v
Ø w
e
0.05
A
E
2
w
C
C
0.08
A
y
B
0.1
A
y
1
32-bit ARM Cortex-M0 microcontroller
A
5 mm
2
y
1
A
1
C
detail X
European
projection
LPC11U1x
C
X
y
© NXP B.V. 2011. All rights reserved.
Issue date
11-01-18
11-03-01
sot1155-2_po
SOT1155-2
59 of 64

Related parts for EA-XPR-007