EA-XPR-007 Embedded Artists, EA-XPR-007 Datasheet - Page 57

• Manufacturer Part Number: EA-XPR-007
• Description: BOARD LPCXPRESSO LPC11U14
• Manufacturer: Embedded Artists

Specifications of EA-XPR-007

• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

NXP Semiconductors
12. Package outline
Fig 32. Package outline HVQFN33
LPC11U1X
Objective data sheet
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 7 x 7 x 0.85 mm
Dimensions
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
mm
Unit
Outline
version
nom
max
min
terminal 1
index area
terminal 1
index area
1.00
0.85
0.80
A
(1)
E
0.05
0.02
0.00
L
A
h
1
8
1
0.35
0.28
0.23
b
IEC
9
32
0.2
c
e
D
7.1
7.0
6.9
(1)
D
33
4.85
4.70
4.55
e
D
D
JEDEC
1
h
h
All information provided in this document is subject to legal disclaimers.
E
7.1
7.0
6.9
(1)
References
b
4.85
4.70
4.55
0
25
E
Rev. 1 — 11 April 2011
h
16
0.65 4.55
e
JEITA
17
24
- - -
w
v
scale
B
e
e
2.5
1
C
C
e
A
E
2
4.55
A
e
2
B
0.75
0.60
0.45
L
A
5 mm
0.1
A
v
1
32-bit ARM Cortex-M0 microcontroller
0.05
w
y
1
0.08
C
y
detail X
European
projection
0.1
y
1
C
LPC11U1x
X
y
© NXP B.V. 2011. All rights reserved.
Issue date
09-03-17
09-03-23
c
hvqfn33_po
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