OM13001,598 NXP Semiconductors, OM13001,598 Datasheet - Page 111
OM13001,598
Manufacturer Part Number
OM13001,598
Description
EA LPC177X/8X EVAL BOARD
Manufacturer
NXP Semiconductors
Series
-r
Type
MCUr
Specifications of OM13001,598
Contents
Board, Cable, Headphones, Registration Card
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
For Use With/related Products
LPC1788
Other names
568-6707
- Current page: 111 of 117
- Download datasheet (2Mb)
NXP Semiconductors
LPC178X_7X
Objective data sheet
Fig 48. Reflow soldering of the LQFP144 package
Footprint information for reflow soldering of LQFP144 package
DIMENSIONS in mm
0.500
P1
0.560
P2
23.300 23.300 20.300 20.300
Hy
solder land
occupied area
Ax
Gy
Ay
C
Bx
By
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
P2
1.500
C
D2 (8×)
0.280
Rev. 2 — 27 May 2011
Generic footprint pattern
D1
0.400 20.500 20.500 23.550 23.550
P1
D2
Gx
Hx
Bx
Ax
Gx
(0.125)
Gy
32-bit ARM Cortex-M3 microcontroller
Hx
D1
Hy
LPC178x/7x
By
© NXP B.V. 2011. All rights reserved.
Ay
sot486-1_fr
SOT486-1
111 of 117
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