EPC9003 EPC, EPC9003 Datasheet - Page 4

• Manufacturer Part Number: EPC9003
• Description: BOARD DEV FOR EPC2010 200V GAN
• Manufacturer: EPC
• Series: -r

Specifications of EPC9003

• Design Resources: EPC9003 Gerber Files EPC9003 Bill of Materials
• Featured Product: EPC Development Tools
• Main Purpose: Power Management, Half H-Bridge Driver (External FET)
• Embedded: No
• Utilized Ic / Part: EPC2010
• Primary Attributes: 200V, 5A Max Output GaNFET Capability
• Secondary Attributes: GaNFET Driver Circuit Uses 7 ~ 12V
• Lead Free Status / Rohs Status: Contains lead / RoHS non-compliant
• Other names: 917-1012

eGaN® FET DATASHEET
EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2011 |
DIE MARKINGS
TAPE AND REEL CONFIGURATION
4mm pitch, 8mm wide tape on 7” reel
7” reel
Figure 11: Transient Thermal Response Curve
0.0001
0.001
0.01
0.1
1
10
Gate Pad solder bar
is under this corner
Die orientation dot
Duty Factors:
0.5
0.2
0.1
0.05
0.02
0.01
-5
a
Dimension (mm)
b
c (note 2)
f (note 2)
c
a
b
d
e
g
10
-4
Single Pulse
d
target
8.00
1.75
3.50
4.00
4.00
2.00
1.5
EPC2010 (note 1)
Normalized Maximum Transient Thermal Impedance
10
min
1.65
3.45
3.90
3.90
1.95
7.90
-3
1.5
e
2010
YYYY
ZZZZ
t
p
, Rectangular Pulse Duration, seconds
8.30
max
1.85
3.55
4.10
4.10
2.05
1.6
10
f
Note 1: MSL1 (moisture sensitivity level 1) classi ed according to IPC/JEDEC industry standard.
Note 2: Pocket position is relative to the sprocket hole measured as true position of the pocket,
-2
not the pocket hole.
EPC2010
Number
g
Part
10
-1
Notes:
Duty Factor: D = t
Peak T
Marking Line 1
Loaded Tape Feed Direction
J
= P
Part #
2010
1
DM
Die is placed into pocket
P
x Z
solder bar side down
DM
θJB
(face side down)
1
/t
x R
Laser Markings
Lot_Date Code
Marking line 2
2
t
θJB
1
10
YYYY
+ T
t
2
B
Lot_Date Code
Marking Line 3
100
solder bar is
orientation
under this
ZZZZ
corner
Gate
dot
Die
EPC2010
| PAGE 4