PCA9502BS,128 NXP Semiconductors, PCA9502BS,128 Datasheet - Page 21
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PCA9502BS,128
Manufacturer Part Number
PCA9502BS,128
Description
IC I/O EXPANDER I2C/SPI 24HVQFN
Manufacturer
NXP Semiconductors
Datasheet
1.PCA9502BS157.pdf
(25 pages)
Specifications of PCA9502BS,128
Package / Case
24-VQFN Exposed Pad, 24-HVQFN, 24-SQFN, 24-DHVQFN
Interface
I²C, SPI
Number Of I /o
8
Interrupt Output
No
Frequency - Clock
400kHz
Voltage - Supply
2.3 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Logic Family
PCA9502
Number Of Lines (input / Output)
8.0 / 8.0
Operating Supply Voltage
2.5 V to 3.3 V
Power Dissipation
300 mW
Operating Temperature Range
- 40 C to + 85 C
Input Voltage
5.5 V
Logic Type
I/O Expander
Maximum Clock Frequency
400 KHz
Mounting Style
SMD/SMT
Number Of Input Lines
8.0
Number Of Output Lines
8.0
Output Current
10 mA
Output Voltage
5.5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
935281363128
PCA9502BS-F
PCA9502BS-F
PCA9502BS-F
PCA9502BS-F
NXP Semiconductors
PCA9502_3
Product data sheet
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 18.
Table 19.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
•
•
2.5
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 18
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
19
20.
Rev. 03 — 13 October 2006
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
8-bit I/O expander with I
Figure
350 to 2000
260
250
245
20) than a PbSn process, thus
220
220
350
2
C-bus/SPI interface
> 2000
260
245
245
PCA9502
© NXP B.V. 2006. All rights reserved.
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