MT47H32M16HR-187E:G Micron Technology Inc, MT47H32M16HR-187E:G Datasheet - Page 7
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MT47H32M16HR-187E:G
Manufacturer Part Number
MT47H32M16HR-187E:G
Description
IC DDR2 SDRAM 512MBIT 84FBGA
Manufacturer
Micron Technology Inc
Series
-r
Datasheet
1.MT47H32M16HR-187EG.pdf
(132 pages)
Specifications of MT47H32M16HR-187E:G
Format - Memory
RAM
Memory Type
DDR2 SDRAM
Memory Size
512M (32Mx16)
Speed
1.875ns
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 85°C
Package / Case
84-TFBGA
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT47H32M16HR-187E:G
Manufacturer:
Micron Technology Inc
Quantity:
10 000
512Mb: x4, x8, x16 DDR2 SDRAM
Features
Figure 51: Bank Read – Without Auto Precharge ............................................................................................. 98
Figure 52: Bank Read – with Auto Precharge ................................................................................................... 99
t
t
Figure 53: x4, x8 Data Output Timing –
DQSQ,
QH, and Data Valid Window ................................................. 100
t
t
Figure 54: x16 Data Output Timing –
DQSQ,
QH, and Data Valid Window ..................................................... 101
t
t
Figure 55: Data Output Timing –
AC and
DQSCK ......................................................................................... 102
Figure 56: Write Burst ................................................................................................................................... 104
Figure 57: Consecutive WRITE-to-WRITE ...................................................................................................... 105
Figure 58: Nonconsecutive WRITE-to-WRITE ................................................................................................ 105
Figure 59: WRITE Interrupted by WRITE ....................................................................................................... 106
Figure 60: WRITE-to-READ ........................................................................................................................... 107
Figure 61: WRITE-to-PRECHARGE ................................................................................................................ 108
Figure 62: Bank Write – Without Auto Precharge ............................................................................................ 109
Figure 63: Bank Write – with Auto Precharge ................................................................................................. 110
Figure 64: WRITE – DM Operation ................................................................................................................ 111
Figure 65: Data Input Timing ........................................................................................................................ 112
Figure 66: Refresh Mode ............................................................................................................................... 113
Figure 67: Self Refresh .................................................................................................................................. 115
Figure 68: Power-Down ................................................................................................................................ 117
Figure 69: READ-to-Power-Down or Self Refresh Entry .................................................................................. 119
Figure 70: READ with Auto Precharge-to-Power-Down or Self Refresh Entry .................................................. 119
Figure 71: WRITE-to-Power-Down or Self Refresh Entry ................................................................................ 120
Figure 72: WRITE with Auto Precharge-to-Power-Down or Self Refresh Entry ................................................. 120
Figure 73: REFRESH Command-to-Power-Down Entry ................................................................................. 121
Figure 74: ACTIVATE Command-to-Power-Down Entry ................................................................................ 121
Figure 75: PRECHARGE Command-to-Power-Down Entry ............................................................................ 122
Figure 76: LOAD MODE Command-to-Power-Down Entry ............................................................................ 122
Figure 77: Input Clock Frequency Change During Precharge Power-Down Mode ........................................... 123
Figure 78: RESET Function ........................................................................................................................... 125
Figure 79: ODT Timing for Entering and Exiting Power-Down Mode .............................................................. 127
Figure 80: Timing for MRS Command to ODT Update Delay .......................................................................... 128
Figure 81: ODT Timing for Active or Fast-Exit Power-Down Mode ................................................................. 128
Figure 82: ODT Timing for Slow-Exit or Precharge Power-Down Modes ......................................................... 129
Figure 83: ODT Turn-Off Timings When Entering Power-Down Mode ............................................................ 129
Figure 84: ODT Turn-On Timing When Entering Power-Down Mode ............................................................. 130
Figure 85: ODT Turn-Off Timing When Exiting Power-Down Mode ............................................................... 131
Figure 86: ODT Turn-On Timing When Exiting Power-Down Mode ................................................................ 132
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PDF: 09005aef82f1e6e2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
512MbDDR2.pdf - Rev. R 12/10 EN
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