MT47H32M16HR-187E:G Micron Technology Inc, MT47H32M16HR-187E:G Datasheet - Page 19
MT47H32M16HR-187E:G
Manufacturer Part Number
MT47H32M16HR-187E:G
Description
IC DDR2 SDRAM 512MBIT 84FBGA
Manufacturer
Micron Technology Inc
Series
-r
Datasheet
1.MT47H32M16HR-187EG.pdf
(132 pages)
Specifications of MT47H32M16HR-187E:G
Format - Memory
RAM
Memory Type
DDR2 SDRAM
Memory Size
512M (32Mx16)
Speed
1.875ns
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 85°C
Package / Case
84-TFBGA
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT47H32M16HR-187E:G
Manufacturer:
Micron Technology Inc
Quantity:
10 000
- Current page: 19 of 132
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Figure 9: 60-Ball FBGA (8mm x 10mm) – x4, x8
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-reflow
on Ø0.35 SMD ball
pads.
60X Ø0.45
Seating
0.12 A
Plane
8 CTR
0.8 TYP
Notes:
A
Nonconductive overmold
9 8 7
1. All dimensions are in millimeters.
2. Solder ball material for this package is also available as leaded eutectic (62% Sn, 36%
Pb, 2% Ag).
6.4 CTR
1.8 CTR
8 ±0.1
0.8 TYP
3 2 1
A
B
C
D
E
F
G
H
J
K
L
19
0.8 ±0.05
10 ±0.1
Ball A1 ID
0.155
Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging
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