DSPIC30F3011-30I/PT Microchip Technology Inc., DSPIC30F3011-30I/PT Datasheet - Page 243

• Manufacturer Part Number: DSPIC30F3011-30I/PT
• Description: 16 BIT MCU/DSP 44LD 30MIPS 24 KB FLASH
• Manufacturer: Microchip Technology Inc.
• Type: DSPr

Specifications of DSPIC30F3011-30I/PT

• A/d Inputs: 9-Channels, 10-Bit
• Cpu Speed: 30 MIPS
• Eeprom Memory: 1K Bytes
• Input Output: 30
• Interface: I2C/SPI/UART, USART
• Ios: 30
• Memory Type: Flash
• Number Of Bits: 16
• Package Type: 44-pin TQFP
• Programmable Memory: 24K Bytes
• Ram Size: 1K Bytes
• Timers: 5-16-bit, 2-32-bit
• Voltage, Range: 2.5-5.5
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
 2004 Microchip Technology Inc.
Architecture
Trademark
Example:
dsPIC30F2010AT-30I/PF = 30 MIPS, Industrial temp., TQFP package, Rev. A
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Device ID
Flash
d s P I C 3 0 F 2 0 1 0 AT- 3 0 I / P F - E S
Preliminary
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
PT = TQFP 10x10
PT = TQFP 12x12
PF = TQFP 14x14
P
SO = SOIC
SP = SPDIP
ML = QFN 6x6 or 8x8
S
W
A,B,C… = Revision Level
Custom ID (3 digits) or
Engineering Sample (ES)
dsPIC30F
= DIP
= Die (Waffle Pack)
= Die (Wafers)
T = Tape and Reel
Package
DS70082G-page 241
.
Speed
20 = 20 MIPS
30 = 30 MIPS