TDA8026ET/C2,551 NXP Semiconductors, TDA8026ET/C2,551 Datasheet - Page 52
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TDA8026ET/C2,551
Manufacturer Part Number
TDA8026ET/C2,551
Description
IC SMART CARD SLOT 64TFBGA
Manufacturer
NXP Semiconductors
Specifications of TDA8026ET/C2,551
Package / Case
64-TFBGA
Controller Type
Smart Card Interface
Interface
I²C
Voltage - Supply
2.7 V ~ 5.5 V
Current - Supply
210mA
Operating Temperature
-25°C ~ 85°C
Mounting Type
Surface Mount
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 25 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
935288286551
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TDA8026ET/C2,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
TDA8026ET/C2,551
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
TDA8026_1
Product data sheet
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 49.
Table 50.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 49
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
50
16.
Rev. 1 — 9 March 2010
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
Multiple smart card slot interface IC
16) than a SnPb process, thus
220
220
350
> 2000
260
245
245
TDA8026
© NXP B.V. 2010. All rights reserved.
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