TDA8026ET/C2,557 NXP Semiconductors, TDA8026ET/C2,557 Datasheet - Page 50
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TDA8026ET/C2,557
Manufacturer Part Number
TDA8026ET/C2,557
Description
IC SMART CARD SLOT 64TFBGA
Manufacturer
NXP Semiconductors
Datasheet
1.TDA8026ETC2518.pdf
(59 pages)
Specifications of TDA8026ET/C2,557
Controller Type
Smart Card Interface
Interface
I²C
Voltage - Supply
2.7 V ~ 5.5 V
Current - Supply
210mA
Operating Temperature
-25°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
64-TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TDA8026ET/C2,557
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
13. Package outline
Fig 15. Package outline SOT1073-1 (TFBGA64)
TDA8026_1
Product data sheet
TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls
DIMENSIONS (mm are the original dimensions)
mm
SOT1073-1
UNIT
VERSION
OUTLINE
max
nom
min
ball A1
index area
ball A1
index area
1.2
1.1
1.0
A
H
G
D
C
B
A
F
E
0.35
0.30
0.25
A
1
1
IEC
- - -
e
0.85
0.80
0.75
A
2
2
3
0.45
0.40
0.35
b
4
e
D
1
7.1
7.0
6.9
JEDEC
D
5
All information provided in this document is subject to legal disclaimers.
- - -
1/2 e
6
REFERENCES
7.1
7.0
6.9
E
b
7
0
Rev. 1 — 9 March 2010
0.8
8
e
JEITA
5.6
1/2 e
e
- - -
1
B
e
scale
2.5
w
v
e
A
E
5.6
e
M
M
2
2
C
C
0.15
A
v
B
5 mm
A
0.08
w
A
2
0.12
Multiple smart card slot interface IC
A
y
1
y
1
C
0.1
y
1
PROJECTION
detail X
EUROPEAN
X
C
y
TDA8026
© NXP B.V. 2010. All rights reserved.
ISSUE DATE
08-03-06
08-03-14
SOT1073-1
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