TDA8034HN/C1,151 NXP Semiconductors, TDA8034HN/C1,151 Datasheet - Page 30

• Manufacturer Part Number: TDA8034HN/C1,151
• Description: IC SMARD CARD INTERFACE 24HVQFN
• Manufacturer: NXP Semiconductors
• Type: Smart Card Interfacer

Specifications of TDA8034HN/C1,151

• Package / Case: 24-VQFN Exposed Pad, 24-HVQFN, 24-SQFN, 24-DHVQFN
• Controller Type: Smart Card Interface
• Interface: Analog
• Voltage - Supply: 1.8V, 3V, 5V
• Current - Supply: 65mA
• Operating Temperature: -25°C ~ 85°C
• Mounting Type: Surface Mount
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935288352151

NXP Semiconductors
21. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
9
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
17
17.1
17.2
17.3
17.4
18
19
20
21
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13
Thermal characteristics . . . . . . . . . . . . . . . . . 14
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 14
Application information. . . . . . . . . . . . . . . . . . 20
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 21
Soldering of SMD packages . . . . . . . . . . . . . . 22
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 25
Legal information. . . . . . . . . . . . . . . . . . . . . . . 26
Contact information. . . . . . . . . . . . . . . . . . . . . 27
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
V
Wave and reflow soldering . . . . . . . . . . . . . . . 22
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Power supplies . . . . . . . . . . . . . . . . . . . . . . . . . 5
Voltage supervisor . . . . . . . . . . . . . . . . . . . . . . 6
Clock circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Input and output circuits . . . . . . . . . . . . . . . . . . 8
Shutdown mode . . . . . . . . . . . . . . . . . . . . . . . . 8
Deep shutdown mode. . . . . . . . . . . . . . . . . . . . 8
Activation sequence . . . . . . . . . . . . . . . . . . . . . 9
Deactivation sequence . . . . . . . . . . . . . . . . . . 10
Fault detection . . . . . . . . . . . . . . . . . . . . . . . . 11
Introduction to soldering . . . . . . . . . . . . . . . . . 22
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 23
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 27
CC
regulator . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
TDA8034HN
Smart card interface
Document identifier: TDA8034HN
Date of release: 17 January 2011
All rights reserved.