IDTSTAC9200X3TAEB1XR IDT, Integrated Device Technology Inc, IDTSTAC9200X3TAEB1XR Datasheet - Page 122

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IDTSTAC9200X3TAEB1XR

Manufacturer Part Number
IDTSTAC9200X3TAEB1XR
Description
IC AUDIO CODEC 2CH HD 48-LQFP
Manufacturer
IDT, Integrated Device Technology Inc
Type
Audio Codec, HDr
Datasheet

Specifications of IDTSTAC9200X3TAEB1XR

Resolution (bits)
24 b
Number Of Adcs / Dacs
2 / 2
Sigma Delta
No
S/n Ratio, Adcs / Dacs (db) Typ
85 / 100
Dynamic Range, Adcs / Dacs (db) Typ
80 / 95
Voltage - Supply, Analog
3.14 V ~ 3.47 V; 3.8 V ~ 4.2 V; 4.28 V ~ 4.73 V; 4.75 V ~ 5.25 V
Voltage - Supply, Digital
3.14 V ~ 3.47 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
48-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
STAC9200X3TAEB1XR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IDTSTAC9200X3TAEB1XR
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
9. SOLDER REFLOW PROFILE
IDT™
STAC9200
2-CHANNEL HIGH DEFINITION AUDIO CODEC
Time maintained above
9.1.
Time within 5
2-CHANNEL HIGH DEFINITION AUDIO CODEC
Note: These devices can be hand soldered at 360
FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface
Mount Devices” (www.jedec.org/download).
Note: All temperatures refer to topside of the package, measured on the package body surface.
Standard Reflow Profile Data
Peak / Classification Temperature (Tp)
Preheat
Average Ramp-Up Rate (Ts
o
Profile Feature
C of actual Peak Temperature (tp)
Time 25
Temperature Max (Ts
Temperature Min (Ts
o
C to Peak Temperature
Time (ts
Temperature (T
Ramp-Down rate
min
max
Time (t
Figure 5. Solder Reflow Profile
- ts
- Tp)
max
max
min
L
L
IDT CONFIDENTIAL
)
)
)
)
)
3
150
200
60 - 180 seconds
217
60 - 150 seconds
See “Package Classification Reflow Temperatures”
on page 123.
20 - 40 seconds
6
8 minutes max
o
C for 3 to 5 seconds.
o
o
C / second max
C / second max
122
o
o
o
C
C
C
Pb Free Assembly
STAC9200
PC AUDIO
V 1.6 01/08

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