IDTSTAC9752AXTAED1XR IDT, Integrated Device Technology Inc, IDTSTAC9752AXTAED1XR Datasheet - Page 100

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IDTSTAC9752AXTAED1XR

Manufacturer Part Number
IDTSTAC9752AXTAED1XR
Description
IC CODEC AC'97 MIC/JACK 48-QFP
Manufacturer
IDT, Integrated Device Technology Inc
Type
Audio Codec '97r
Datasheet

Specifications of IDTSTAC9752AXTAED1XR

Resolution (bits)
20 b
Number Of Adcs / Dacs
2 / 2
Sigma Delta
Yes
S/n Ratio, Adcs / Dacs (db) Typ
85 / 92
Voltage - Supply, Analog
3.14 V ~ 3.47 V; 4.75 V ~ 5.25 V
Voltage - Supply, Digital
3.14 V ~ 3.47 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
48-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
STAC9752AXTAED1XR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IDTSTAC9752AXTAED1XR
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
IDT™
AC’97 2.3 CODECS WITH STEREO MICROPHONE & UNIVERSAL JACK
STAC9752A/9753A
AC’97 2.3 CODECS WITH STEREO MICROPHONE & UNIVERSAL JACK
13.3. PC Board Recommendations for 32-pad QFN Package
0.50 mm typical
NOTES:
1. Oblong pad is preferred geometry.
2. Oblong pad may be replaced with Rectangular pad of the same overall
3. Oblong pad may be replaced with Bullet pad of the same overall dimensions. If
4. Solderpaste shall be oblong pad regardless of the pad geometry. Solderpaste
5. Recommended solderpaste stencil thickness is 0.127 mm, electropolished.
6. Soldermask is to be 1 mm larger in X- and Y-dimensions.
dimensions.
a Bullet pad is used, flat shall be to the outside.
opening shall be the same dimensions as pad detail.
2.375 mm
4.75 mm
SUGGESTED FOOTPRINT
Figure 28. Recommended PCB Layout for 32-pad QFN Package
1
8
32
16
2.375 mm
24
4.75 mm
100
0.375 mm
PAD DETAIL
0.75 mm
STAC9752A/9753A
0.15 mm
0.30 mm
PC AUDIO
V 1.5 1206

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