IDT92HD75B1X3NLGXYAX8 IDT, Integrated Device Technology Inc, IDT92HD75B1X3NLGXYAX8 Datasheet - Page 213
IDT92HD75B1X3NLGXYAX8
Manufacturer Part Number
IDT92HD75B1X3NLGXYAX8
Description
IC AUDIO CODEC HD 4CH 32-VFQFPN
Manufacturer
IDT, Integrated Device Technology Inc
Type
Audio Codec, HDr
Datasheet
1.IDT92HD75B1X3NLGXYAX8.pdf
(214 pages)
Specifications of IDT92HD75B1X3NLGXYAX8
Resolution (bits)
24 b
Number Of Adcs / Dacs
2 / 2
Sigma Delta
No
S/n Ratio, Adcs / Dacs (db) Typ
86 / 95
Dynamic Range, Adcs / Dacs (db) Typ
86 / 93
Voltage - Supply, Analog
3.14 V ~ 3.47 V; 3.8 V ~ 4.2 V; 4.28 V ~ 4.73 V; 4.75 V ~ 5.25 V
Voltage - Supply, Digital
3.14 V ~ 3.47 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
32-VFQFN, 32-VFQFPN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
92HD75B1X3NLGXYAX8
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4-CHANNEL HD AUDIO CODECS OPTIMIZED FOR LOW POWER
12. SOLDER REFLOW PROFILE
92HD75B
4-CHANNEL HD AUDIO CODECS OPTIMIZED FOR LOW POWER
12.1. Standard Reflow Profile Data
Time maintained above:
Time within 5
Preheat:
Note: All temperatures refer to topside of the package, measured on the package body surface.
Peak / Classification Temperature (Tp)
Profile Feature
Note: These devices can be hand soldered at 360
FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices” (www.jedec.org/download).
Average Ramp-Up Rate (Ts
o
C of actual Peak Temperature (tp)
Time 25
Temperature Max (Ts
Temperature Min (Ts
o
C to Peak Temperature
Time (ts
Temperature (T
Ramp-Down rate
Table 20. Standard Reflow Profile
Figure 19. Solder Reflow Profile
min
max
Time (t
- ts
- Tp)
max
max
min
L
L
)
)
)
)
)
3
150
200
60 - 180 seconds
217
60 - 150 seconds
See “Package Classification Reflow Temperatures” .
20 - 40 seconds
6
8 minutes max
o
o
213
C / second max
C / second max
o
o
o
C
C
C
o
C for 3 to 5 seconds.
Pb Free Assembly
92HD75B
PC AUDIO
V 1.0 01-09
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