TSPC603RVGH8LC Atmel, TSPC603RVGH8LC Datasheet - Page 50

• Manufacturer Part Number: TSPC603RVGH8LC
• Description: IC MPU 32BIT 8MHZ 255CBGA
• Manufacturer: Atmel

Specifications of TSPC603RVGH8LC

• Processor Type: PowerPC 603e 32-Bit RISC
• Speed: 200MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 255-CBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

15.3
15.3.1
50
CI-CGA Package Parameters
TSPC603R
Mechanical Dimensions of the CI-CGA Package
The package parameters are as provided in the following list. The package type is 21 mm,
255-lead ceramic ball grid array (CI-CGA).
Figure 15-3
CGA package.
Package outline
Interconnects
Pitch
Typical module height
provides the mechanical dimensions and bottom surface nomenclature of the CI-
255
1.27 mm
21 mm × 21 mm
3.84 mm
5410B–HIREL–09/05