XPC8240LZU200E Freescale Semiconductor, XPC8240LZU200E Datasheet - Page 43

• Manufacturer Part Number: XPC8240LZU200E
• Description: MCU HOST PROCESSOR 352-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of XPC8240LZU200E

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 200MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 352-TBGA
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 200MHz
• Embedded Interface Type: I2C
• Digital Ic Case Style: TBGA
• No. Of Pins: 352
• Supply Voltage Range: 2.5V To 2.75V
• Rohs Compliant: No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure.
As shown, the performance of these thermal interface materials improves with increased contact pressure.
The use of thermal grease significantly reduces the interface thermal resistance, that is, the bare joint results
in a thermal resistance approximately seven times greater than that of the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 26). Therefore, the synthetic grease offers the best thermal performance, considering the low
interface pressure. Of course, the selection of any thermal interface material depends on many factors:
thermal performance requirements, manufacturability, service temperature, dielectric properties, cost, and
so on.
The board designer can choose between several types of thermal interfaces. Heat sink adhesive materials
should be selected based on high conductivity and yet adequate mechanical strength to meet equipment
shock/vibration requirements. The following venders provide several commercially-available thermal
interfaces and adhesive materials:
MPC8240 Integrated Processor Hardware Specifications
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
1.5
0.5
2
1
0
Figure 29. Thermal Performance of Select Thermal Interface Material
0
10
Freescale Semiconductor, Inc.
For More Information On This Product,
20
Go to: www.freescale.com
Contact Pressure (psi)
30
40
50
781-935-4850
800-248-2481
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
60
System Design Information
70
80
43