MPC8260AVVPJDB Freescale Semiconductor, MPC8260AVVPJDB Datasheet - Page 49

IC MPU POWERQUICC II 480-TBGA

MPC8260AVVPJDB

Manufacturer Part Number
MPC8260AVVPJDB
Description
IC MPU POWERQUICC II 480-TBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8260AVVPJDB

Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
300MHz
Voltage
2V
Mounting Type
Surface Mount
Package / Case
480-TBGA
Family Name
MPC82XX
Device Core
PowerQUICC II
Device Core Size
32b
Frequency (max)
300MHz
Instruction Set Architecture
RISC
Operating Supply Voltage (max)
2.2V
Operating Supply Voltage (min)
1.9V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
480
Package Type
TBGA
For Use With
MPC8260ADS-TCOM - BOARD DEV ADS POWERQUICC II
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant

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Freescale Semiconductor
Revision
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0
11/2001
11/2001
8/2003
1/2003
5/2002
3/2002
3/2002
2/2002
8/2001
Date
Initial version
• Note: In revision 0.3, sp30
• Removal of “HiP4 PowerQUICC II Documentation” table. These supplemental specifications have
• Addition of
• Addition of VCCSYN to “Note: Core, PLL, and I/O Supply Voltages” following
• Addition of note 1 to
• Addition of notes or modifications to
• Addition of
• Addition of note 2 to
• Note 2 for
• Section 2.1: Removal of “Warning” recommending use of bootstrap diodes. They are not needed.
• Note 2 for
• Addition of note at beginning of Section 3.2
• Note 1 for
• Revision of
• Modifications to
• Modification to pinout diagram,
• Additional revisions to text and figures throughout
“Document Revision History” Table.
been replaced by revision 1 of the MPC8260 PowerQUICC II™ Family Reference Manual .
Figure 1
Table
Table
Table
addition of SPICLK to PC19. They are documented correctly in the parallel I/O ports chapter in the
MPC8260 PowerQUICC II™ Family Reference Manual but had previously been omitted from
Table
Table
Table
Table
Figure
Figure
Table
Section 1,
Section 1,
Table
Table
Table
Table
Table
Table
to 0011_100 and 1011_000 to 1011_1000
Table
Table
Table
Table
Table
Table
Table 23. Document Revision History (continued)
4: Changes to θ
9: Change of sp10.
21: Addition of FCC2 Rx and Tx [3,4] to CPM pins PD7, PD18, PD19, and PD29. Also, the
21.
2: Modification to supply voltage ranges reflected in notes 2, 3, and 4.
4: Addition of θ
7,
14,
2: Note 2 (changes in italics): “... less than or equal to 233 MHz, 166 MHz CPM...”
2: Addition of note 3.
21: Modified notes to pins AE11 and AF25.
21: Modified notes to pins AE11 and AF25.
21: Addition of note to pins AA1 and AG4 (Therm0 and Therm1).
19: Core and bus frequency values for the following ranges of MODCK_HMODCK: 0011_000
21: Notes added to pins at AE11, AF25, U5, and V4.
1: note 3
9: Change to sp12.
10: Change to sp32.
21: Additions to B27, C28, D25, D27, E26, G29, H26–28, N25, P29, AF25, AA25, AB27
8: Change to sp20/sp21.
3,
5,
Figure
and
Figure
Figure
Table
Table 2
Table 16
Table 18
“Features”: minimum supported core frequency of 150 MHz
“Features”: updated performance values (under “Dual-issue integer core”)
Figure 2
Table
Table
Section 1,
8: Addition of sp42a/sp43a.
17, and
Figure
4: Addition of note for FCC output.
6,
15.
5, “Power Dissipation”
(changes in italics): “...greater than or equal to 266 MHz, 200 MHz CPM...”
Figure
and
and
Table 3
Table 21
JB
JA
9,
and θ
Table
“Features”: Addition of MPC8255 notes
Table 17
Table 19
and θ
Table 2,Table
(Table
7: Addition of notes.
JC
19: Removal of PLL bypass mode from clock tables.
JB
.
Figure 13
and θ
10) was changed. This change was not previously recorded in this
Substantive Changes
Figure
JC
10,
.
6,
Table
Figure
11, and
7, and
Table 18
Figure 8
Document Revision History
Table 2
49

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