MPC8260AVVPJDB Freescale Semiconductor, MPC8260AVVPJDB Datasheet - Page 19

IC MPU POWERQUICC II 480-TBGA

MPC8260AVVPJDB

Manufacturer Part Number
MPC8260AVVPJDB
Description
IC MPU POWERQUICC II 480-TBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8260AVVPJDB

Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
300MHz
Voltage
2V
Mounting Type
Surface Mount
Package / Case
480-TBGA
Family Name
MPC82XX
Device Core
PowerQUICC II
Device Core Size
32b
Frequency (max)
300MHz
Instruction Set Architecture
RISC
Operating Supply Voltage (max)
2.2V
Operating Supply Voltage (min)
1.9V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
480
Package Type
TBGA
For Use With
MPC8260ADS-TCOM - BOARD DEV ADS POWERQUICC II
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant

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Table 10
Freescale Semiconductor
1
Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal.
Timings are measured at the pin.
sp33a
sp33b
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0
sp31
sp32
sp34
sp35
Max
lists SIU output characteristics.
Spec Number
Activating data pipelining (setting BRx[DR] in the memory controller)
improves the AC timing. When data pipelining is activated, sp12 can be
used for data bus setup even when ECC or PARITY are used. Also, sp33a
can be used as the AC specification for DP signals.
sp30
sp30
sp30
sp30
sp30
sp30
Min
PSDVAL/TEA/TA
ADD/ADD_atr./BADDR/CI/GBL/WT
Data bus
DP
Memory controller signals/ALE
All other signals
Table 10. AC Characteristics for SIU Outputs
Characteristic
NOTE
66 MHz 83 MHz 66 MHz 83 MHz
Max Delay (ns)
6.5
7
8
8
6
6
1
Electrical and Thermal Characteristics
6.5
6.5
5.5
6
7
5
Min Delay (ns)
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
19

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