MPC8260AVVPJDB Freescale Semiconductor, MPC8260AVVPJDB Datasheet - Page 12

• Manufacturer Part Number: MPC8260AVVPJDB
• Description: IC MPU POWERQUICC II 480-TBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8260AVVPJDB

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 300MHz
• Voltage: 2V
• Mounting Type: Surface Mount
• Package / Case: 480-TBGA
• Family Name: MPC82XX
• Device Core: PowerQUICC II
• Device Core Size: 32b
• Frequency (max): 300MHz
• Instruction Set Architecture: RISC
• Operating Supply Voltage (max): 2.2V
• Operating Supply Voltage (min): 1.9V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 480
• Package Type: TBGA
• For Use With: MPC8260ADS-TCOM - BOARD DEV ADS POWERQUICC II
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Compliant

Electrical and Thermal Characteristics
2.2
Table 4
2.3
The average chip-junction temperature
where
For most applications P
T
Solving equations (1) and (2) for K gives:
12
J
is the following:
2
3
1
2
3
4
5
The leakage current is measured for nominal VDD, VCCSYN, and VDD.
MPC8265 and MPC8266 only.
Junction to ambient
Junction to board
Junction to case
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0
T
T
θ
P
P
P
P
K = P
Assumes a single layer board with no thermal vias
Natural convection
Assumes a four layer board
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
describes thermal characteristics.
A
D
INT
I/O
D
JA
J
Thermal Characteristics
Power Considerations
= T
= ambient temperature °C
= P
= K/(T
= package thermal resistance
= power dissipation on input and output pins (determined by user)
= I
D
A
INT
DD
x (T
+ (P
Characteristics
J
+ P
x V
+ 273° C)
A
D
5
+ 273° C) +
I/O
x
4
DD
θ
I/O
JA
Watts (chip internal power)
Table 4. Thermal Characteristics for 480 TBGA Package
)
< 0.3 x P
θ
JA
x P
INT
,
junction to ambient
,
D
. If P
T
2
J
,
in °C can be obtained from the following:
Symbol
I/O
θ
θ
θ
JA
JB
JC
is neglected
,
°C/W
,
Value
an approximate relationship between P
13
10
11
1.1
8
4
3
1
1
3
°C/W
°C/W
°C/W
Unit
Freescale Semiconductor
Air Flow
1 m/s
1 m/s
NC
NC
—
—
2
(2)
(1)
(3)
D
and