XC2VP30-6FGG676C Xilinx Inc, XC2VP30-6FGG676C Datasheet - Page 225

• Manufacturer Part Number: XC2VP30-6FGG676C
• Description: IC FPGA VIRTEX-II PRO 676-FBGA
• Manufacturer: Xilinx Inc
• Series: Virtex™-II Pror

Specifications of XC2VP30-6FGG676C

• Number Of Logic Elements/cells: 30816
• Number Of Labs/clbs: 3424
• Total Ram Bits: 2506752
• Number Of I /o: 416
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 676-BBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Gates: -

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Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Pinout Information
FF896 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 5: FF896 Flip-Chip Fine-Pitch BGA Package Specifications
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DS083 (v4.7) November 5, 2007
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Product Specification
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