XC2VP30-6FGG676C Xilinx Inc, XC2VP30-6FGG676C Datasheet - Page 129

• Manufacturer Part Number: XC2VP30-6FGG676C
• Description: IC FPGA VIRTEX-II PRO 676-FBGA
• Manufacturer: Xilinx Inc
• Series: Virtex™-II Pror

Specifications of XC2VP30-6FGG676C

• Number Of Logic Elements/cells: 30816
• Number Of Labs/clbs: 3424
• Total Ram Bits: 2506752
• Number Of I /o: 416
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 676-BBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Gates: -

DS083 (v4.7) November 5, 2007
This document provides Virtex™-II Pro Device/Package
Combinations, Maximum I/Os, and Virtex-II Pro Pin Defini-
tions, followed by pinout tables, for these packages:
•
•
•
•
•
Virtex-II Pro Device/Package Combinations and Maximum I/Os
Wire-bond and flip-chip packages are available.
Table 2
wire-bond and flip-chip packages, respectively.
•
•
•
Table 2: Flip-Chip Packages Information
Table 3
and the number of differential I/O pairs for each Virtex-II Pro device/package combination. The number of I/Os per package
includes all user I/Os except the fifteen control pins (CCLK, DONE, M0, M1, M2, PROG_B, PWRDWN_B, TCK, TDI, TDO,
TMS, HSWAP_EN, DXN, DXP, and RSVD), the nine (per transceiver) RocketIO MGT pins (TXP, TXN, RXP, RXN,
AVCCAUXTX, AVCCAUXRX, VTTX, VTRX, and GNDA), and for Virtex-II Pro X devices only, the two BREFCLKN/
BREFCLKP differential clock input pairs (four pins). The Virtex-II Pro X devices are highlighted in bold type.
1. Unless otherwise noted, "Virtex-II Pro" refers to members of the Virtex-II Pro and/or Virtex-II Pro X families.
© 2002–2007 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. PowerPC is
a trademark of IBM Corp. and is used under license. All other trademarks are the property of their respective owners.
DS083 (v4.7) November 5, 2007
Product Specification
Pitch (mm)
Size (mm)
Maximum I/Os
FG256/FGG256 Fine-Pitch BGA Package
FG456/FGG456 Fine-Pitch BGA Package
FG676/FGG676 Fine-Pitch BGA Package
FF672 Flip-Chip Fine-Pitch BGA Package
FF896 Flip-Chip Fine-Pitch BGA Package
FG denotes wire-bond fine-pitch BGA
(1.00 mm pitch).
FGG denotes Pb-free wire-bond fine-pitch BGA
(1.00 mm pitch).
FF denotes flip-chip fine-pitch BGA
(1.00 mm pitch)
Package
shows the number of available I/Os, the number of RocketIO™ (or RocketIO X) multi-gigabit transceiver (MGT) pins,
show the maximum number of user I/Os possible in
27 x 27
FF672
1.00
396
R
3
0
2
31 x 31
FF896
Virtex-II Pro and Virtex-II Pro X Platform FPGAs:
1.00
556
Table 1
FF1152
35 x 35
1.00
www.xilinx.com
644
and
•
•
•
•
•
For device pinout diagrams and layout guidelines, refer to
the
pinout files are also available for download from the Xilinx
website (
.
Table 1: Wire-Bond Packages Information
Notes:
1. Wire-bond packages include FGGnnn Pb-free versions. See
Pitch (mm)
Size (mm)
Maximum I/Os
FF1148
35 x 35
Virtex-II Pro Platform FPGA User Guide
FF1152 Flip-Chip Fine-Pitch BGA Package
FF1148 Flip-Chip Fine-Pitch BGA Package
FF1517 Flip-Chip Fine-Pitch BGA Package
FF1704 Flip-Chip Fine-Pitch BGA Package
FF1696 Flip-Chip Fine-Pitch BGA Package
Virtex-II Pro Ordering Examples (Module
Package
1.00
812
www.xilinx.com
(1)
FF1517
40 x 40
1.00
964
FGG256
FG256/
17 x 17
1.00
140
).
Pinout Information
(1)
42.5 x 42.5
FF1704
FGG456
1040
1.00
FG456/
23 x 23
Product Specification
1.00
248
1).
. ASCII package
42.5 x 42.5
Module 4 of 4
FF1696
FGG676
FG676/
26 x 26
1200
1.00
1.00
412
1