EPF10K100EFC484-1 Altera, EPF10K100EFC484-1 Datasheet - Page 47

IC FLEX 10KE FPGA 100K 484-FBGA

EPF10K100EFC484-1

Manufacturer Part Number
EPF10K100EFC484-1
Description
IC FLEX 10KE FPGA 100K 484-FBGA
Manufacturer
Altera
Series
FLEX-10KE®r
Datasheet

Specifications of EPF10K100EFC484-1

Number Of Logic Elements/cells
4992
Number Of Labs/clbs
624
Total Ram Bits
49152
Number Of I /o
338
Number Of Gates
257000
Voltage - Supply
2.375 V ~ 2.625 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
484-FBGA
Family Name
FLEX 10KE
Number Of Usable Gates
100000
Number Of Logic Blocks/elements
4992
# Registers
338
# I/os (max)
338
Frequency (max)
333.33MHz
Process Technology
CMOS
Operating Supply Voltage (typ)
2.5V
Logic Cells
4992
Ram Bits
49152
Device System Gates
257000
Operating Supply Voltage (min)
2.375V
Operating Supply Voltage (max)
2.625V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
484
Package Type
FC-FBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
544-1935
EPF10K100EFC484-1

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Generic Testing
Operating
Conditions
V
V
V
I
T
T
T
Symbol
Table 19. FLEX 10KE 2.5-V Device Absolute Maximum Ratings
OUT
STG
AMB
J
CCINT
CCIO
I
Supply voltage
DC input voltage
DC output current, per pin
Storage temperature
Ambient temperature
Junction temperature
Parameter
Each FLEX 10KE device is functionally tested. Complete testing of each
configurable static random access memory (SRAM) bit and all logic
functionality ensures 100% yield. AC test measurements for FLEX 10KE
devices are made under conditions equivalent to those shown in
Figure
all stages of the production flow.
Figure 21. FLEX 10KE AC Test Conditions
Tables 19
recommended operating conditions, DC operating conditions, and
capacitance for 2.5-V FLEX 10KE devices.
Power supply transients can affect AC
measurements. Simultaneous transitions of
multiple outputs should be avoided for
accurate measurement. Threshold tests
must not be performed under AC
conditions. Large-amplitude, fast-ground-
current transients normally occur as the
device outputs discharge the load
capacitances. When these transients flow
through the parasitic inductance between
the device ground pin and the test system
ground, significant reductions in
observable noise immunity can result.
Numbers in brackets are for 2.5-V devices
or outputs. Numbers without brackets are
for 3.3-V. devices or outputs.
21. Multiple test patterns can be used to configure devices during
With respect to ground
No bias
Under bias
PQFP, TQFP, BGA, and FineLine BGA
packages, under bias
Ceramic PGA packages, under bias
through
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
23
provide information on absolute maximum ratings,
Conditions
(2)
Note (1)
Device
Output
Device input
rise and fall
times < 3 ns
8.06 k
[481
[481
703
]
]
–0.5
–0.5
–2.0
Min
–25
–65
–65
5.75
Max
C1 (includes
JIG capacitance)
150
135
135
150
3.6
4.6
25
System
VCCIO
Unit
Test
mA
° C
° C
° C
° C
V
V
V
47

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