XC3S1400AN-4FGG676C Xilinx Inc, XC3S1400AN-4FGG676C Datasheet - Page 8
![IC SPARTAN-3AN FPGA 1400K 676FBG](/photos/6/73/67300/b-676_sml.jpg)
XC3S1400AN-4FGG676C
Manufacturer Part Number
XC3S1400AN-4FGG676C
Description
IC SPARTAN-3AN FPGA 1400K 676FBG
Manufacturer
Xilinx Inc
Series
Spartan™-3ANr
Datasheets
1.XC3S50A-4VQG100C.pdf
(7 pages)
2.XC3S50AN-4TQG144C.pdf
(2 pages)
3.XC3S50AN-4TQG144C.pdf
(123 pages)
Specifications of XC3S1400AN-4FGG676C
Total Ram Bits
589824
Number Of Logic Elements/cells
25344
Number Of Labs/clbs
2816
Number Of I /o
502
Number Of Gates
1400000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
676-BBGA
No. Of Logic Blocks
25344
No. Of Gates
1400000
No. Of Macrocells
25344
Family Type
Spartan-3AN
No. Of Speed Grades
4
No. Of I/o's
502
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
122-1552
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC3S1400AN-4FGG676C
Manufacturer:
XILINX
Quantity:
201
Company:
Part Number:
XC3S1400AN-4FGG676C
Manufacturer:
Xilinx Inc
Quantity:
10 000
Part Number:
XC3S1400AN-4FGG676C
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
Ordering Information
X-Ref Target - Figure 5
Revision History
The following table shows the revision history for this document.
DS557 (v4.1) April 1, 2011
Product Specification
XC3S50AN
XC3S200AN -5 High Performance
XC3S400AN
XC3S700AN
XC3S1400AN
Notes:
1.
2.
Device
02/26/07
08/16/07
09/12/07
12/12/07
06/02/08
11/19/09
12/02/10
04/01/11
The -5 speed grade is exclusively available in the Commercial temperature range.
See
Date
Table 4
Package Type/Number of Pins
-4 Standard Performance TQ144/
and
Version
Table 5
Speed Grade
2.0.1
1.0
2.0
3.0
3.1
3.2
4.0
4.1
for available package combinations.
Speed Grade
Device Type
Example:
Initial release.
Updated for Production release of initial device.
Noted that only dual-mark devices are guaranteed for both -4I and -5C.
Updated to Production status with Production release of final family member, XC3S50AN. Noted that
non-Pb-free packages may be available for selected devices.
Minor updates.
Updated document throughout to reflect availability of Pb package options. Added references to the
Extended Spartan-3A family. Removed table note 2 from
added table note 4, and updated table note 2. Added
Updated
In
XC3S50AN. In
Pb and Pb-Free Packaging
the XC3S50AN, XC3S400AN, and XC3S1400AN.
Table
(1)
TQG144
FT256/
FTG256
FG400/
FGG400
FG484/
FGG484
FG676/
FGG676
2, revised the Maximum Differential I/O Pairs and Maximum User I/O values for the
Notice of
Figure 5: Device Numbering Format
XC3S50AN -4 TQG144
Table
144-pin Thin Quad Flat Pack (TQFP)
256-ball Fine-Pitch Thin Ball Grid Array (FTBGA) I
400-ball Fine-Pitch Ball Grid Array (FBGA)
484-ball Fine-Pitch Ball Grid Array (FBGA)
676-ball Fine-Pitch Ball Grid Array (FBGA)
Disclaimer.
4, added packages to the XC3S50AN, XC3S400AN, and XC3S1400AN. Updated
Package Type / Number of Pins
Spartan-3AN FPGA Family: Introduction and Ordering Information
www.xilinx.com
section and
Table 5
C
Revision
to include the new device/package combinations for
Temperature Range:
C = Commercial (T
I = Industrial (T
Table
Table
5.
2. In
J
Table
= -40
C Commercial (0°C to 85°C)
J
Temperature Range (T
= 0
Industrial (–40°C to 100°C)
4, added Pb packages,
o
C to 100
DS557-1_05_101109
o
C to 85
o
o
C)
C)
J
)
8