DSPB56725AF Freescale Semiconductor, DSPB56725AF Datasheet - Page 45
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DSPB56725AF
Manufacturer Part Number
DSPB56725AF
Description
DSP 24BIT AUD 250MHZ 80-LQFP
Manufacturer
Freescale Semiconductor
Series
Symphony™r
Type
Audio Processorr
Specifications of DSPB56725AF
Interface
Host Interface, I²C, SAI, SPI
Clock Rate
250MHz
Non-volatile Memory
External
On-chip Ram
112kB
Voltage - I/o
3.30V
Voltage - Core
1.20V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
80-LQFP
Processor Series
DSP567xx
Core
56300
Leaded Process Compatible
Yes
Rohs Compliant
Yes
Peak Reflow Compatible (260 C)
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPB56725AF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
FIGURE NOTES:
1
2
3
4
5
6
7
Freescale Semiconductor
Dimensioning and tolerancing per ASME Y.14.5M–1994.
Controlling dimension: millimeter.
Data plane H is located at the bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom
of the parting line.
Datum E, F and to be determined at datum plane H.
Dimensions to be determined at seating plane C.
Dimensions do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions include mold mismatch and
are determined at datum plane H.
Dimension does not include dambar protrusion Dambar protrusion shall not cause the lead width to exceed 0.46 mm. Minimum
space between protrusion and adjacent lead or protrusion is 0.07mm.
Symphony
Figure 35. 80-Pin Package Outline Drawing (continued)
™
DSP56724/ DSP56725 Multi-Core Audio Processors, Rev. 2
45