MSC8126TVT6400 Freescale Semiconductor, MSC8126TVT6400 Datasheet - Page 14

• Manufacturer Part Number: MSC8126TVT6400
• Description: IC DSP QUAD 16B 400MHZ 431FCPBGA
• Manufacturer: Freescale Semiconductor
• Series: MSC81xx StarCorer
• Type: SC140 Corer

Specifications of MSC8126TVT6400

• Interface: DSI, Ethernet, RS-232
• Clock Rate: 400MHz
• Non-volatile Memory: External
• On-chip Ram: 1.436MB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 431-FCPBGA
• Device Core Size: 16b
• Clock Freq (max): 400MHz
• Mips: 400
• Device Input Clock Speed: 400MHz
• Operating Supply Voltage (typ): 1.1/1.1/1.2/1.2/3.3V
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 431
• Package Type: FCBGA
• For Use With: MSC8126ADSE - KIT ADVANCED DEV SYSTEM 8126
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Electrical Characteristics
2.2
Table 3 lists recommended operating conditions. Proper device operation outside of these conditions is not guaranteed.
2.3
Table 4 describes thermal characteristics of the MSC8126 for the FC-PBGA packages.
Section 3.5, Thermal Considerations provides a detailed explanation of these characteristics.
14
Junction-to-ambient
Junction-to-ambient, four-layer board
Junction-to-board (bottom)
Junction-to-case
Junction-to-package-top
Notes:
Core and PLL supply voltage:
• Standard
• Reduced (300 and 400 MHz)
I/O supply voltage
Input voltage
Operating temperature range:
• Standard
• Extended
— 400 MHz
— 500 MHz
1.
2.
3.
4.
5.
6.
Recommended Operating Conditions
Thermal Characteristics
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
5
1, 2
Characteristic
6
4
Rating
MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15
1, 3
Table 4. Thermal Characteristics for the MSC8126
Table 3. Recommended Operating Conditions
Symbol
R
R
R
R
Ψ
θJC
θJA
θJA
θJB
JT
Symbol
V
V
CCSYN
V
V
DDH
T
T
DD
IN
Convection
J
J
Natural
0.9
26
19
9
1
20
FC-PBGA
×
–0.2 to V
20 mm
3.135 to 3.465
1.14 to 1.26
1.16 to 1.24
1.07 to 1.13
–40 to 105
0 to 90
(1 m/s) airflow
Value
200 ft/min
5
DDH
Freescale Semiconductor
21
15
+0.2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C
°C
V
V
V
V
V