MSC8126TVT6400 Freescale Semiconductor, MSC8126TVT6400 Datasheet - Page 45

• Manufacturer Part Number: MSC8126TVT6400
• Description: IC DSP QUAD 16B 400MHZ 431FCPBGA
• Manufacturer: Freescale Semiconductor
• Series: MSC81xx StarCorer
• Type: SC140 Corer

Specifications of MSC8126TVT6400

• Interface: DSI, Ethernet, RS-232
• Clock Rate: 400MHz
• Non-volatile Memory: External
• On-chip Ram: 1.436MB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 431-FCPBGA
• Device Core Size: 16b
• Clock Freq (max): 400MHz
• Mips: 400
• Device Input Clock Speed: 400MHz
• Operating Supply Voltage (typ): 1.1/1.1/1.2/1.2/3.3V
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 431
• Package Type: FCBGA
• For Use With: MSC8126ADSE - KIT ADVANCED DEV SYSTEM 8126
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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Freescale Semiconductor
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MSC8126 Technical Data Sheet (MSC8126). Details the signals, AC/DC characteristics, clock signal characteristics,
package and pinout, and electrical design considerations of the MSC8126 device.
MSC8126 Reference Manual (MSC8126RM). Includes functional descriptions of the extended cores and all the
internal subsystems including configuration and programming information.
Application Notes. Cover various programming topics related to the StarCore DSP core and the MSC8126 device.
SC140 DSP Core Reference Manual. Covers the SC140 core architecture, control registers, clock registers, program
control, and instruction set.
Package Information
Product Documentation
Figure 35. MSC8126 Mechanical Information, 431-pin FC-PBGA Package
MSC8126 Quad Digital Signal Processor Data Sheet, Rev. 15
Notes:
1. All dimensions in millimeters.
2. Dimensioning and tolerancing
3. Features are symmetrical about
4. Maximum solder ball diameter
5. Datum A, the seating plane, is
6. Parallelism measurement shall
7. Capacitors may not be present
8. Caution must be taken not to
9. FC CBGA (Ceramic) package
10.Pin 1 indicator can be in the
per ASME Y14.5M–1994.
the package center lines unless
dimensioned otherwise.
measured parallel to Datum A.
determined by the spherical
crowns of the solder balls.
exclude any effect of mark on
top surface of package.
on all devices.
short capacitors or exposed
metal capacitor pads on
package top.
code: 5238.
FC PBGA (Plastic) package
code: 5263.
form of number 1 marking or an
“L” shape marking.
Package Information
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