EPM2210F324C5N Altera, EPM2210F324C5N Datasheet - Page 88

• Manufacturer Part Number: EPM2210F324C5N
• Description: IC MAX II CPLD 2210 LE 324-FBGA
• Manufacturer: Altera
• Series: MAX® IIr

Specifications of EPM2210F324C5N

• Programmable Type: In System Programmable
• Delay Time Tpd(1) Max: 7.0ns
• Voltage Supply - Internal: 2.5V, 3.3V
• Number Of Logic Elements/blocks: 2210
• Number Of Macrocells: 1700
• Number Of I /o: 272
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 324-FBGA
• Voltage: 2.5V, 3.3V
• Memory Type: FLASH
• Number Of Logic Elements/cells: 2210
• Family Name: MAX II
• # Macrocells: 1700
• Frequency (max): 1.8797GHz
• Propagation Delay Time: 11.2ns
• Number Of Logic Blocks/elements: 221
• # I/os (max): 272
• Operating Supply Voltage (typ): 2.5/3.3V
• In System Programmable: Yes
• Operating Supply Voltage (min): 2.375V
• Operating Supply Voltage (max): 3.6V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 324
• Package Type: FBGA
• For Use With: P0305 - KIT MAX II MICRO
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 544-1961; EPM2210F324C5N

6–2
Referenced Documents
Document Revision History
Table 6–1. Document Revision History
MAX II Device Handbook
August 2009,
version 1.6
October 2008,
version 1.5
December 2007,
version 1.4
December 2006,
version 1.3
October 2006,
version 1.2
June 2005,
version 1.1
Date and Revision
This chapter references the following document:
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Table 6–1
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Package Information
Updated
Updated New Document Format.
Added “Referenced Documents” section.
Updated Figure 6–1.
Added document revision history.
Updated Figure 6-1.
Removed Dual Marking section.
shows the revision history for this chapter.
Figure
6–1.
chapter in the MAX II Device Handbook
Changes Made
Chapter 6: Reference and Ordering Information
Added information for speed
grade –8
Updated document with
MAX IIZ information.
© August 2009 Altera Corporation
Summary of Changes
Referenced Documents
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