GA355QR7GB103KW01L Murata Electronics, GA355QR7GB103KW01L Datasheet - Page 212

• Manufacturer Part Number: GA355QR7GB103KW01L
• Manufacturer: Murata Electronics

!Note
6. Correction with a Soldering Iron
Table 3
7. Washing
8. Handling
FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY
RESULT, WORST CASE, IN A SHORT CIRCUIT AND
FUMING WHEN THE PRODUCT IS USED.
194
G--18/21/31
G--32/42/43/
52/55
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
!Caution
"Temperature Differential" between iron tip and the
Part Number
Optimum Solder Amount when re-working Using a
When sudden heat is applied to the components by use
of a soldering iron, the mechanical strength of the
components will decrease because the extreme
temperature change causes deformations inside the
components.
In order to prevent mechanical damage to the
components, preheating is required for both the
components and the PCB board.
Preheating conditions, (The "Temperature of the
Soldering Iron Tip", "Preheating Temperature,"
Soldering Iron
For sizes smaller than Gpp18, the top of the solder fillet
should be lower than 2/3 of the thickness of the
component or 0.5mm whichever is smaller.
For sizes larger than Gpp21, the top of the solder fillet
should be lower than 2/3 of the thickness of the
component.
If the solder amount is excessive, the risk of cracking is
higher during board bending or under any other stressful
conditions.
A Soldering iron ø3mm or smaller should be used.
It is also necessary to keep the soldering iron from
touching the components during the re-work.
Solder wire with ø0.5mm or smaller is required for
soldering.
Excessive output of ultrasonic oscillation during cleaning
causes PCBs to resonate, resulting in cracked chips or
broken solder. Take note not to vibrate PCBs.
Do not directly touch the chip capacitor, especially the
ceramic body. Residue from hands/fingers may create a
short circuit environment.
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.
Temperature
of Soldering
350°C max.
280°C max.
Iron Tip
Temperature
150°C min.
150°C min.
Preheating
Temperature
Differential
ΔTV190D
ΔTV130D
(ΔT)
Atmosphere
air
air
components and the PCB), should be within the
conditions of table 3.
It is required to keep the temperature differential between
the soldering Iron and the component's surface (ΔT) as
small as possible.
After soldering, do not allow the component/PCB to cool
down rapidly.
The operating time for the re-working should be as short
as possible. When re-working time is too long, it may
cause solder leaching, in turn causing a reduction of the
adhesive strength of the terminations.
Solder Amount
in section
C02E.pdf
Oct.1,2012