GA355QR7GB103KW01L Murata Electronics, GA355QR7GB103KW01L Datasheet - Page 143

• Manufacturer Part Number: GA355QR7GB103KW01L
• Manufacturer: Murata Electronics

!Note
4-2. Flow Soldering
1. When sudden heat is applied to the components, the
2. Excessively long soldering time or high soldering
3. When components are immersed in solvent after
4. Do not apply flow soldering to chips not listed in table 2.
Table 2
Recommended Conditions
5. Optimum Solder Amount for Flow Soldering
Preheating Peak Temperature
Soldering Peak Temperature
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage in the components, preheating
should be required for both of the components and the
PCB board.
Preheating conditions are shown in table 2. It is required
to keep the temperature differential between the solder
and the component's surface (ΔT) as small as possible.
temperature can result in leaching of the outer electrodes,
causing poor adhesion or a reduction in capacitance
value due to loss of contact between electrodes and end
termination.
mounting, be sure to maintain the temperature difference
(ΔT) between the component and solvent within the range
shown in the table 2.
5-1. The top of the solder fillet should be lower than the
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.
thickness of components. If the solder amount is
excessive, the risk of cracking is higher during board
bending or any other stressful condition.
GRM18/21/31
LLL21/31
GQM18/21
Atmosphere
Part Number
Pb-Sn Solder
240 to 250°C
90 to 110°C
Air
Temperature Differential
ΔTV150°C
Lead Free Solder
100 to 120°C
250 to 260°C
N
2
[Standard Conditions for Flow Soldering]
[Allowable Flow Soldering Temperature and Time]
Temperature (D)
Preheating
Peak
Temperature
Soldering
Peak
Temperature
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
280
270
260
250
240
230
220
0
Adhesive
30-90 seconds
10
Preheating
ΔT
20
Continued on the following page.
Soldering
5 seconds max.
Soldering Time (sec.)
30
Up to Chip Thickness
!Caution
Gradual
Cooling
Time
in section
40
125
C02E.pdf
Oct.1,2012