GA355QR7GB103KW01L Murata Electronics, GA355QR7GB103KW01L Datasheet - Page 141

• Manufacturer Part Number: GA355QR7GB103KW01L
• Manufacturer: Murata Electronics

!Note
2. Information before Mounting
1. Do not reuse capacitors that were removed from the
2. Confirm capacitance characteristics under actual applied
3. Confirm the mechanical stress under actual process and
4. Confirm the rated capacitance, rated voltage and other
5. Prior to use, confirm the solderability of capacitors that
6. Prior to measuring capacitance, carry out a heat
7. The use of Sn-Zn based solder will deteriorate the
3. Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not
2. Dirt particles and dust accumulated between the suction
equipment.
voltage.
equipment use.
electrical characteristics before assembly.
were in long-term storage.
treatment for capacitors that were in long-term storage.
reliability of the MLCC.
Please contact our sales representative or product
engineers on the use of Sn-Zn based solder in advance.
applied to the capacitors.
1-1. In mounting the capacitors on the printed circuit
nozzle and the cylinder inner wall prevent the nozzle from
moving smoothly. This imposes greater force upon the
chip during mounting, causing cracked chips. Also, the
locating claw, when worn out, imposes uneven forces on
the chip when positioning, causing cracked chips. The
suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.
board, any bending force against them shall be kept
to a minimum to prevent them from any bending
damage or cracking. Please take into account the
following precautions and recommendations for use
in your process.
(1) Adjust the lowest position of the pickup nozzle so
(2) Adjust the nozzle pressure within a static load of
as not to bend the printed circuit board.
1N to 3N during mounting.
[Incorrect]
[Correct]
Suction Nozzle
Board
Support Pin
Deflection
Continued on the following page.
!Caution
Board Guide
123
C02E.pdf
Oct.1,2012