GA355QR7GB103KW01L Murata Electronics, GA355QR7GB103KW01L Datasheet - Page 144

• Manufacturer Part Number: GA355QR7GB103KW01L
• Manufacturer: Murata Electronics

!Note
4-3. Correction with a Soldering Iron
1. When sudden heat is applied to the components when
2. After soldering, do not allow the component/PCB to cool
3. The operating time for the re-working should be as short
4. Optimum solder amount when re-working with a soldering
4-4. Leaded Component Insertion
1. If the PCB is flexed when leaded components (such as
5. Washing
Excessive ultrasonic oscillation during cleaning can cause
the PCBs to resonate, resulting in cracked chips or broken
solder joints. Take note not to vibrate PCBs.
126
!Caution
using a soldering iron, the mechanical strength of the
components will decrease because the extreme
temperature change can cause deformations inside the
components. In order to prevent mechanical damage to
the components, preheating is required for both the
components and the PCB board. Preheating conditions
(The "Temperature of the Soldering Iron Tip", "Preheating
Temperature," "Temperature Differential" between the
iron tip and the components and the PCB), should be
within the conditions of table 3. It is required to keep the
temperature differential between the soldering iron and
the component surfaces (ΔT) as small as possible.
down rapidly.
as possible. When re-working time is too long, it may
cause solder leaching, in turn causing a reduction in the
adhesive strength of the terminations.
iron
4-1. For sizes smaller than 0603, (GRM03/15/18,
4-2. A soldering iron with a tip of ø3mm or smaller should
4-3. Solder wire with ø0.5mm or smaller is required for
transformers and ICs) are being mounted, chips may
crack and solder joints may break.
Before mounting leaded components, support the PCB
using backup pins or special jigs to prevent warping.
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.
GJM03/15, GQM18), the top of the solder fillet
should be lower than
component or 0.5mm whichever is smaller. For 0805
and larger sizes, (GRM21/31/32/43/55, GQM21/22),
the top of the solder fillet should be lower than
the thickness of the component. If the solder amount
is excessive, the risk of cracking is higher during
board bending or under any other stressful condition.
be used. It is also necessary to keep the soldering
iron from touching the components during the
re-work.
soldering.
2
/
3
of the thickness of the
2
/
3
of
Table 3
GRM03/15/18/21/31
GJM03/15
GQM18/21
GRM32/43/55
GQM22
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Part Number
350°C max.
280°C max.
Temperature
of Soldering
Iron Tip
Temperature
150°C min.
150°C min.
Preheating
Continued on the following page.
Temperature
ΔTV190°C
ΔTV130°C
Differential
Solder Amount
(ΔT)
in section
Atmosphere
Air
Air
C02E.pdf
Oct.1,2012