MT45W256KW16PEGA-70 WT Micron Technology Inc, MT45W256KW16PEGA-70 WT Datasheet - Page 27

• Manufacturer Part Number: MT45W256KW16PEGA-70 WT
• Manufacturer: Micron Technology Inc

Specifications of MT45W256KW16PEGA-70 WT

• Operating Temperature (max): 85C
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Compliant

Package Dimensions
Figure 24:
PDF: 09005aef8329b746 / Source: 09005aef82f264aa
8mb_4mb_asyncpage_cr1_0_p22z__2.fm - Rev. B 4/08 EN
and temperature range for production devices. Although considered final, these specifications are subject to change, as fur-
their respective owners. This data sheet contains minimum and maximum limits specified over the complete power supply
Technology, Inc., inside the U.S. and a trademark of Qimonda AG outside the U.S. All other trademarks are the property of
Seating
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. CellularRAM is a trademark of Micron
plane
Dimensions apply
to solder balls
post-reflow.
Pre-reflow ball
diameter is 0.35
on a 0.30 SMD
ball pad.
0.10 A
5.25
48X Ø0.37
Ball A6
48-Ball VFBGA
2.625
0.70 ±0.05
A
Notes:
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
ther product development and data characterization sometimes occur.
1. All dimensions are in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. The MT45W256KW16PE uses “green” packaging.
1.875
0.25mm per side.
6.00 ±0.10
0.75
TYP
3.75
C L
3.00 ±0.05
4Mb: 256K x16 Async/Page CellularRAM 1.0 Memory
0.75 TYP
C L
4.00 ±0.05
Ball A1
Ball A1 ID
27
8.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
96.5% Sn, 3% Ag, 0.5% Cu
Package Dimensions
©2008 Micron Technology, Inc. All rights reserved.
Ball A1 ID