MT47H32M16HR-25E IT:F TR Micron Technology Inc, MT47H32M16HR-25E IT:F TR Datasheet - Page 72
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MT47H32M16HR-25E IT:F TR
Manufacturer Part Number
MT47H32M16HR-25E IT:F TR
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H32M16HR-25E_ITF_TR.pdf
(131 pages)
Specifications of MT47H32M16HR-25E IT:F TR
Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
400ps
Maximum Clock Rate
800MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
295mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Compliant
Table 40: Minimum Delay with Auto Precharge Enabled
DESELECT
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. Q 10/10 EN
From Command (Bank n)
WRITE with auto precharge
READ with auto precharge
The DESELECT function (CS# HIGH) prevents new commands from being executed by
the DDR2 SDRAM. The DDR2 SDRAM is effectively deselected. Operations already in
progress are not affected. DESELECT is also referred to as COMMAND INHIBIT.
10. The number of clock cycles required to meet
4. REFRESH and LOAD MODE commands may only be issued when all banks are idle.
5. Not used.
6. All states and sequences not shown are illegal or reserved.
7. READs or WRITEs listed in the Command/Action column include READs or WRITEs with
8. A WRITE command may be applied after the completion of the READ burst.
9. Requires appropriate DM.
WRITE or WRITE with auto precharge
WRITE or WRITE with auto precharge
auto precharge enabled and READs or WRITEs with auto precharge disabled.
is greater.
READ or READ with auto precharge
READ or READ with auto precharge
READ with auto
precharge enabled/
WRITE with auto
precharge enabled:
The minimum delay from a READ or WRITE command with auto precharge enabled to
a command to a different bank is summarized in Table 40 (page 72).
PRECHARGE or ACTIVATE
PRECHARGE or ACTIVATE
To Command (Bank m)
The READ with auto precharge enabled or WRITE with auto pre-
charge enabled states can each be broken into two parts: the
access period and the precharge period. For READ with auto pre-
charge, the precharge period is defined as if the same burst was
executed with auto precharge disabled and then followed with
the earliest possible PRECHARGE command that still accesses all
of the data in the burst. For WRITE with auto precharge, the pre-
charge period begins when
auto precharge was disabled. The access period starts with regis-
tration of the command and ends where the precharge period
(or
such that when a READ with auto precharge is enabled or a
WRITE with auto precharge is enabled, any command to other
banks is allowed, as long as that command does not interrupt
the read or write data transfer already in process. In either case,
all other related limitations apply (contention between read da-
ta and write data must be avoided).
72
t
RP) begins. This device supports concurrent auto precharge
Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
(with Concurrent Auto Precharge)
t
WTR is either two or
(CL - 1) + (BL/2) +
t
Minimum Delay
WR ends, with
(BL/2) + 2
(BL/2)
(BL/2)
1
1
© 2004 Micron Technology, Inc. All rights reserved.
t
t
t
WTR
WR measured as if
WTR/
Commands
t
CK, whichever
Units
t
t
t
t
t
t
CK
CK
CK
CK
CK
CK