MT41J256M8DA-125:H Micron Technology Inc, MT41J256M8DA-125:H Datasheet - Page 27

• Manufacturer Part Number: MT41J256M8DA-125:H
• Manufacturer: Micron Technology Inc

Specifications of MT41J256M8DA-125:H

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Figure 11: 82-Ball FBGA – x4, x8; "JE"
Seating
PDF: 09005aef826aaadc
2Gb_DDR3_SDRAM.pdf – Rev. K 04/10 EN
Solder ball
material: SAC305.
Dimensions apply
to solder balls
post-reflow on
Ø0.33 NSMD
ball pads.
9.6 CTR
plane
0.12 A
82X Ø0.45
0.8 TYP
A
11 10 9
Note:
8
12.5 ±0.15
1. All dimensions are in millimeters.
8 CTR
0.8 TYP
4
3
2
1
0.75 ±0.1
A
B
C
D
E
F
G
H
J
K
L
M
N
Ball A1 ID
15 ±0.15
27
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
2Gb: x4, x8, x16 DDR3 SDRAM
1.2 MAX
Ball A1 ID
Package Dimensions
© 2006 Micron Technology, Inc. All rights reserved.