DAC1405D750HW/C1,5 NXP Semiconductors, DAC1405D750HW/C1,5 Datasheet - Page 2

IC DAC 14BIT SRL/SPI 100HTQFP

DAC1405D750HW/C1,5

Manufacturer Part Number
DAC1405D750HW/C1,5
Description
IC DAC 14BIT SRL/SPI 100HTQFP
Manufacturer
NXP Semiconductors
Datasheet

Specifications of DAC1405D750HW/C1,5

Settling Time
20ns
Number Of Bits
14
Data Interface
Serial, SPI™
Number Of Converters
2
Voltage Supply Source
Analog and Digital
Power Dissipation (max)
1.11W
Operating Temperature
-45°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
100-TQFP Exposed Pad, 100-eTQFP, 100-HTQFP, 100-VQFP
Conversion Rate
750 MSPs
Resolution
14 bit
Interface Type
SPI
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Maximum Power Dissipation
1.11 W
Minimum Operating Temperature
- 40 C
Supply Current
44 mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-5089

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DAC1405D750HW/C1,5
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
DAC1405D750
Product data sheet
Type number
DAC1405D750HW
Ordering information
Package
Name
HTQFP100
Wireless infrastructure: LTE, WiMAX, GSM, CDMA, WCDMA, TD-SCDMA
Communication: LMDS/MMDS, point-to-point
Direct Digital Synthesis (DDS)
Broadband wireless systems
Digital radio links
Instrumentation
Automated Test Equipment (ATE)
Description
plastic thermal enhanced thin quad flat package; 100 leads;
body 14  14  1 mm; exposed die pad
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 7 September 2010
Dual 14-bit DAC, up to 750 Msps; 4 and 8 interpolating
DAC1405D750
© NXP B.V. 2010. All rights reserved.
Version
SOT638-1
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